Issued Patents All Time
Showing 51–75 of 77 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6639638 | LCD cover optical structure and method | Ramesh R. Kodnani, Mark V. Pierson, William J. Rudik | 2003-10-28 |
| 6594891 | Process for forming multi-layer electronic structures | James Steven Kamperman, Thomas P. Gall | 2003-07-22 |
| 6562654 | Tented plated through-holes and method for fabrication thereof | John S. Kresge, James R. Wilcox | 2003-05-13 |
| 6538213 | High density design for organic chip carriers | Timothy F. Carden, Todd W. Davies, Ross W. Keesler, Robert David Sebesta, Cheryl L. Tytran-Palomaki | 2003-03-25 |
| 6373717 | Electronic package with high density interconnect layer | Francis J. Downes, Jr., Donald S. Farquhar, Elizabeth Foster, Robert M. Japp, Gerald W. Jones +3 more | 2002-04-16 |
| 6351393 | Electronic package for electronic components and method of making same | John S. Kresge, Robert David Sebesta, James R. Wilcox | 2002-02-26 |
| 6248958 | Resistivity control of CIC material | Bonnie McClure | 2001-06-19 |
| 6249045 | Tented plated through-holes and method for fabrication thereof | John S. Kresge, James R. Wilcox | 2001-06-19 |
| 6178630 | Conductive bonding design and method for aluminum backed circuits | Lisa J. Jimarez, David N. Light, Andrew Seman | 2001-01-30 |
| 6156484 | Gray scale etching for thin flexible interposer | Ernest Bassous, Gobinda Das, Frank D. Egitto, Natalie B. Feilchenfeld, Elizabeth Foster +4 more | 2000-12-05 |
| 6098280 | Process for forming multi-layer electronic structures including a cap for providing a flat surface for DCA and solder ball attach and for sealing plated through holes | James Steven Kamperman, Thomas P. Gall | 2000-08-08 |
| 5925206 | Practical method to make blind vias in circuit boards and other substrates | Chris M. Boyko, Donald S. Farquhar, Richard J. Supa | 1999-07-20 |
| 5920037 | Conductive bonding design for metal backed circuits | Lisa J. Jimarez, David N. Light, Andrew Seman | 1999-07-06 |
| 5875011 | Liquid crystal display tile interconnected to a tile carrier and method | Mark V. Pierson, Michael A. Gaynes, Thurston Bryce Youngs, Jr. | 1999-02-23 |
| 5875010 | Display panel having individual display devices bonded to light transmitting plates which have a combined area greater than of the devices | Jeffrey C. Baechtle, Michael A. Gaynes, Mark V. Pierson, Anne Marie Quinn | 1999-02-23 |
| 5781413 | Method and apparatus for directing the input/output connection of integrated circuit chip cube configurations | Wayne J. Howell, John S. Kresge, James R. Wilcox | 1998-07-14 |
| 5777705 | Wire bond attachment of a liquid crystal display tile to a tile carrier | Mark V. Pierson, Steven F. Arndt, Michael A. Gaynes, Lawrence R. Cutting | 1998-07-07 |
| 5773195 | Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic structures including the cap, and a process of forming the cap and for forming multi-layer electronic structures including the cap | James Steven Kamperman, Thomas P. Gall | 1998-06-30 |
| 5770476 | Passive interposer including at least one passive electronic component | — | 1998-06-23 |
| 5759046 | Dendritic interconnection system | Anthony P. Ingraham, Jaynal A. Molla | 1998-06-02 |
| 5734560 | Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic sturctures including the cap | James Steven Kamperman, Thomas P. Gall | 1998-03-31 |
| 5669775 | Assembly for mounting components to flexible cables | Jeffrey S. Campbell, James D. Herard, Ronald Peter Nowak, John R. Slack | 1997-09-23 |
| 5669833 | Soccer training system | — | 1997-09-23 |
| 5659951 | Method for making printed circuit board with flush surface lands | Thomas P. Gall, Russell Thomas White, Jr., James R. Wilcox | 1997-08-26 |
| 5530288 | Passive interposer including at least one passive electronic component | — | 1996-06-25 |