Issued Patents All Time
Showing 26–50 of 163 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9613921 | Structure to prevent solder extrusion | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2017-04-04 |
| 9607862 | Extrusion-resistant solder interconnect structures and methods of forming | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2017-03-28 |
| 9583451 | Conductive pillar shaped for solder confinement | Charles L. Arvin, Jeffrey P. Gambino, Christopher D. Muzzy | 2017-02-28 |
| 9466547 | Passivation layer topography | Charles L. Arvin, Brian M. Erwin, Jeffrey P. Gambino, Christopher D. Muzzy | 2016-10-11 |
| 9397054 | Semiconductor structure with an interconnect level having a conductive pad and metallic structure such as a base of a crackstop | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2016-07-19 |
| 9331037 | Preventing misshaped solder balls | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2016-05-03 |
| 9324669 | Use of electrolytic plating to control solder wetting | Charles L. Arvin, Brian M. Erwin, Eric D. Perfecto | 2016-04-26 |
| 9269683 | Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2016-02-23 |
| 9257352 | Semiconductor test wafer and methods for use thereof | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2016-02-09 |
| 9231046 | Capacitor using barrier layer metallurgy | Timothy H. Daubenspeck, Jeffrey P. Gambino, Zhong-Xiang He, Christopher D. Muzzy | 2016-01-05 |
| 9230929 | Semiconductor structures and methods of manufacture | Timothy H. Daubenspeck, Jeffrey P. Gambino, Zhong-Xiang He, Christopher D. Muzzy, Timothy D. Sullivan | 2016-01-05 |
| 9190318 | Method of forming an integrated crackstop | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2015-11-17 |
| 9190376 | Organic coating to inhibit solder wetting on pillar sidewalls | Charles L. Arvin, Brian M. Erwin, Eric D. Perfecto, Thomas A. Wassick | 2015-11-17 |
| 9177928 | Contact and solder ball interconnect | Charles L. Arvin, Eric D. Perfecto | 2015-11-03 |
| 9165850 | Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2015-10-20 |
| 9165831 | Dice before grind with backside metal | Timothy H. Daubenspeck, Jeffrey P. Gambino, Charles F. Musante, Christopher D. Muzzy, Timothy D. Sullivan | 2015-10-20 |
| 9159696 | Plug via formation by patterned plating and polishing | Timothy H. Daubenspeck, Jeffrey P. Gambino, Ekta Misra, Christopher D. Muzzy | 2015-10-13 |
| 9142501 | Under ball metallurgy (UBM) for improved electromigration | Charles L. Arvin, Minhua Lu, Eric D. Perfecto, David J. Russell, Krystyna W. Semkow +1 more | 2015-09-22 |
| 9105465 | Wafer edge conditioning for thinned wafers | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2015-08-11 |
| 9087754 | Structures and methods for improving solder bump connections in semiconductor devices | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2015-07-21 |
| 9059106 | Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2015-06-16 |
| 9058460 | Thermally-optimized metal fill for stacked chip systems | Douglas M. Daley, Hung H. Tran, Wayne H. Woods, Jr., Ze Zhang | 2015-06-16 |
| 9040390 | Releasable buried layer for 3-D fabrication and methods of manufacturing | Timothy H. Daubenspeck, Steven E. Molis, Gordon C. Osborne, Jr., Edmund J. Sprogis | 2015-05-26 |
| 9018760 | Solder interconnect with non-wettable sidewall pillars and methods of manufacture | Charles L. Arvin, Raschid J. Bezama, Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy +3 more | 2015-04-28 |
| 9000585 | Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Jeffrey S. Zimmerman | 2015-04-07 |