Issued Patents All Time
Showing 51–75 of 163 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8994173 | Solder bump connection and method of making | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2015-03-31 |
| 8937009 | Far back end of the line metallization method and structures | Timothy H. Daubenspeck, Jeffrey P. Gambino, Karen P. McLaughlin, Ekta Misra, Christopher D. Muzzy +1 more | 2015-01-20 |
| 8933540 | Thermal via for 3D integrated circuits structures | Timothy H. Daubenspeck, Jeffrey P. Gambino, Michael J. Hauser, Christopher D. Muzzy, Timothy D. Sullivan | 2015-01-13 |
| 8927334 | Overcoming chip warping to enhance wetting of solder bumps and flip chip attaches in a flip chip package | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Nathalie Normand, David L. Questad +1 more | 2015-01-06 |
| 8927869 | Semiconductor structures and methods of manufacture | Timothy H. Daubenspeck, Jeffrey P. Gambino, Zhong-Xiang He, Christopher D. Muzzy, Timothy D. Sullivan | 2015-01-06 |
| 8916464 | Structures and methods for improving solder bump connections in semiconductor devices | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2014-12-23 |
| 8916463 | Wire bond splash containment | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2014-12-23 |
| 8896138 | Chip identification for organic laminate packaging and methods of manufacture | Albert J. Banach, Timothy H. Daubenspeck | 2014-11-25 |
| 8835229 | Chip identification for organic laminate packaging and methods of manufacture | Albert J. Banach, Timothy H. Daubenspeck | 2014-09-16 |
| 8819933 | Method for forming a current distribution structure | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2014-09-02 |
| 8809182 | Pad cushion structure and method of fabrication for Pb-free C4 integrated circuit chip joining | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2014-08-19 |
| 8791372 | Reducing impedance discontinuity in packages | Paul M. Harvey, Douglas O. Powell, Yaping Zhou | 2014-07-29 |
| 8778792 | Solder bump connections | Timothy H. Daubenspeck, Jeffrey P. Gambino, Ekta Misra, Christopher D. Muzzy, George J. Scott | 2014-07-15 |
| 8766439 | Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2014-07-01 |
| 8759210 | Control of silver in C4 metallurgy with plating process | Charles L. Arvin, Jennifer D. Schuler | 2014-06-24 |
| 8742594 | Structure and method of making an offset-trench crackstop that forms an air gap adjacent to a passivated metal crackstop | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2014-06-03 |
| 8742578 | Solder volume compensation with C4 process | Charles L. Arvin, Eric D. Perfecto, Jennifer D. Schuler | 2014-06-03 |
| 8710656 | Redistribution layer (RDL) with variable offset bumps | Timothy H. Daubenspeck, Brian M. Erwin, Jeffrey P. Gambino, George J. Scott | 2014-04-29 |
| 8680689 | Coplanar waveguide for stacked multi-chip systems | Timothy H. Daubenspeck, Hanyi Ding, Guoan Wang, Wayne H. Woods, Jr. | 2014-03-25 |
| 8680675 | Structures and methods for improving solder bump connections in semiconductor devices | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2014-03-25 |
| 8637392 | Solder interconnect with non-wettable sidewall pillars and methods of manufacture | Charles L. Arvin, Raschid J. Bezama, Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy +3 more | 2014-01-28 |
| 8629557 | Structures and methods for detecting solder wetting of pedestal sidewalls | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2014-01-14 |
| 8592976 | Ball-limiting-metallurgy layers in solder ball structures | Charles L. Arvin, Timothy H. Daubenspeck, Timothy D. Sullivan | 2013-11-26 |
| 8580673 | Underfill flow guide structures and method of using same | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Marie-Claude Paquet, Timothy D. Sullivan | 2013-11-12 |
| 8575007 | Selective electromigration improvement for high current C4s | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Thomas A. Wassick | 2013-11-05 |