Issued Patents All Time
Showing 76–100 of 163 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8546253 | Self-aligned polymer passivation/aluminum pad | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2013-10-01 |
| 8513814 | Buffer pad in solder bump connections and methods of manufacture | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2013-08-20 |
| 8508043 | Metal pad structure for thickness enhancement of polymer used in electrical interconnection of semiconductor die to semiconductor chip package substrate with solder bump | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, David L. Questad, Timothy D. Sullivan | 2013-08-13 |
| 8492267 | Pillar interconnect chip to package and global wiring structure | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2013-07-23 |
| 8492892 | Solder bump connections | Timothy H. Daubenspeck, Jeffrey P. Gambino, Ekta Misra, Christopher D. Muzzy, George J. Scott | 2013-07-23 |
| 8476762 | Ni plating of a BLM edge for Pb-free C4 undercut control | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2013-07-02 |
| 8440917 | Method and apparatus to reduce impedance discontinuity in packages | Paul M. Harvey, Douglas O. Powell, Yaping Zhou | 2013-05-14 |
| 8426247 | Polymer and solder pillars for connecting chip and carrier | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2013-04-23 |
| 8415260 | Chip identification for organic laminate packaging and methods of manufacture | Albert J. Banach, Timothy H. Daubenspeck | 2013-04-09 |
| 8409980 | Underfill flow guide structures and method of using same | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Marie-Claude Paquet, Timothy D. Sullivan | 2013-04-02 |
| 8373275 | Fine pitch solder bump structure with built-in stress buffer | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2013-02-12 |
| 8361598 | Substrate anchor structure and method | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2013-01-29 |
| 8350383 | IC chip package having IC chip with overhang and/or BGA blocking underfill material flow and related methods | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2013-01-08 |
| 8299611 | Ball-limiting-metallurgy layers in solder ball structures | Charles L. Arvin, Timothy H. Daubenspeck, Timothy D. Sullivan | 2012-10-30 |
| 8298930 | Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof | Charles L. Arvin, Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2012-10-30 |
| 8299568 | Damage propagation barrier | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2012-10-30 |
| 8299581 | Passivation layer extension to chip edge | Timothy H. Daubenspeck, Ekta Misra, Marie-Claude Paquet, Francis Santerre | 2012-10-30 |
| 8264078 | Metal wiring structures for uniform current density in C4 balls | Timothy H. Daubenspeck, Timothy D. Sullivan, Steven L. Wright, Edmund J. Sprogis | 2012-09-11 |
| 8242012 | Integrated circuit structure incorporating a conductor layer with both top surface and sidewall passivation and a method of forming the integrated circuit structure | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2012-08-14 |
| 8237279 | Collar structure around solder balls that connect semiconductor die to semiconductor chip package substrate | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2012-08-07 |
| 8227333 | Ni plating of a BLM edge for Pb-free C4 undercut control | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2012-07-24 |
| 8198133 | Structures and methods to improve lead-free C4 interconnect reliability | Timothy H. Daubenspeck, Paul F. Fortier, Jeffrey P. Gambino, Christopher D. Muzzy, David L. Questad +1 more | 2012-06-12 |
| 8164188 | Methods of forming solder connections and structure thereof | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2012-04-24 |
| 8159067 | Underfill flow guide structures | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Marie-Claude Paquet, Timothy D. Sullivan | 2012-04-17 |
| 8138099 | Chip package solder interconnect formed by surface tension | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2012-03-20 |