Issued Patents All Time
Showing 101–125 of 163 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8114767 | Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Jeffrey S. Zimmerman | 2012-02-14 |
| 8084858 | Metal wiring structures for uniform current density in C4 balls | Timothy H. Daubenspeck, Timothy D. Sullivan, Steven L. Wright, Edmund J. Sprogis | 2011-12-27 |
| 8044510 | Product and method for integration of deep trench mesh and structures under a bond pad | Ephrem G. Gebreselasie, William T. Motsiff, Steven H. Voldman | 2011-10-25 |
| 7989358 | Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch | Timothy H. Daubenspeck, Jeffrey P. Gambino, Jerome B. Lasky, Christopher D. Muzzy | 2011-08-02 |
| 7985671 | Structures and methods for improving solder bump connections in semiconductor devices | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2011-07-26 |
| 7958477 | Structure, failure analysis tool and method of determining white bump location using failure analysis tool | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Jeffrey S. Zimmerman | 2011-06-07 |
| 7939390 | Gap capacitors for monitoring stress in solder balls in flip chip technology | Stephen P. Ayotte, Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2011-05-10 |
| 7935408 | Substrate anchor structure and method | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2011-05-03 |
| 7911803 | Current distribution structure and method | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2011-03-22 |
| 7910408 | Damage propagation barrier and method of forming | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2011-03-22 |
| 7875502 | Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners | Peter J. Brofman, Jon A. Casey, Ian D. Melville, David L. Questad, Thomas A. Wassick | 2011-01-25 |
| 7871919 | Structures and methods for improving solder bump connections in semiconductor devices | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2011-01-18 |
| 7871920 | Semiconductor chips with reduced stress from underfill at edge of chip | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2011-01-18 |
| 7867820 | Methods for forming co-planar wafer-scale chip packages | Lloyd Burrell, Howard H. Chen, Louis L. Hsu | 2011-01-11 |
| 7862987 | Method for forming an electrical structure comprising multiple photosensitive materials | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2011-01-04 |
| 7863734 | Dual-sided chip attached modules | Kerry Bernstein, Timothy J. Dalton, Timothy H. Daubenspeck, Jeffrey P. Gambino, Mark D. Jaffe +3 more | 2011-01-04 |
| 7859122 | Final via structures for bond pad-solder ball interconnections | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, David L. Questad | 2010-12-28 |
| 7851911 | Semiconductor chip used in flip chip process | Charles F. Carey, Bernt Julius Hansen, Ashwani K. Malhotra, David L. Questad | 2010-12-14 |
| 7843069 | Wire bond pads | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2010-11-30 |
| 7825511 | Undercut-free BLM process for Pb-free and Pb-reduced C4 | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2010-11-02 |
| 7777339 | Semiconductor chips with reduced stress from underfill at edge of chip | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2010-08-17 |
| 7754574 | Optimum padset for wire bonding RF technologies with high-Q inductors | Douglas D. Coolbaugh, Zhong-Xiang He, Barbara Waterhouse | 2010-07-13 |
| 7732932 | Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners | Peter J. Brofman, Jon A. Casey, Ian D. Melville, David L. Questad, Thomas A. Wassick | 2010-06-08 |
| 7716992 | Sensor, method, and design structure for a low-k delamination sensor | John J. Maloney, Thomas A. Wassick, Jeffrey S. Zimmerman | 2010-05-18 |
| 7709876 | Gap capacitors for monitoring stress in solder balls in flip chip technology | Stephen P. Ayotte, Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy | 2010-05-04 |