| 7316971 |
Wire bond pads |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy |
2008-01-08 |
| 7273804 |
Internally reinforced bond pads |
David Angell, Frederic Beaulieu, Takashi Hisada, Adreanne Kelly, Samuel McKnight +4 more |
2007-09-25 |
| 7265433 |
On-pad broadband matching network |
Edward R. Pillai, Louis L. Hsu, Daniel W. Storaska |
2007-09-04 |
| 7256503 |
Chip underfill in flip-chip technologies |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, David L. Questad |
2007-08-14 |
| 7250311 |
Wirebond crack sensor for low-k die |
Toyohiro Aoki, Lloyd Burrell |
2007-07-31 |
| 7232695 |
Method and apparatus for completely covering a wafer with a passivating material |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Jeffrey S. Zimmerman |
2007-06-19 |
| 7176583 |
Damascene patterning of barrier layer metal for C4 solder bumps |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy |
2007-02-13 |
| 7170181 |
Optimum padset for wire bonding RF technologies with high-Q inductors |
Douglas D. Coolbaugh, Zhong-Xiang He, Barbara Waterhouse |
2007-01-30 |
| 7112470 |
Chip dicing |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy |
2006-09-26 |
| 7025891 |
Method of polishing C4 molybdenum masks to remove molybdenum peaks |
Steven R. Codding, Timothy C. Krywanczyk, Joseph Danaher, John C. Malinowski, James R. Palmer +2 more |
2006-04-11 |
| 6995475 |
I/C chip suitable for wire bonding |
Julie C. Biggs, Tien-Jen Cheng, David E. Eichstadt, Lisa A. Fanti, Jonathan H. Griffith +6 more |
2006-02-07 |
| 6924210 |
Chip dicing |
Timothy H. Daubenspeck, William T. Motsiff, Christopher D. Muzzy |
2005-08-02 |
| 6864578 |
Internally reinforced bond pads |
David Angell, Frederic Beaulieu, Takashi Hisada, Adreanne Kelly, Samuel McKnight +4 more |
2005-03-08 |
