Issued Patents All Time
Showing 51–75 of 140 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9000585 | Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Jeffrey S. Zimmerman | 2015-04-07 |
| 8994173 | Solder bump connection and method of making | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2015-03-31 |
| 8945955 | Method of changing reflectance or resistance of a region in an optoelectronic memory device | Fen Chen, Richard S. Kontra, Tom C. Lee, Theodore M. Levin, Timothy D. Sullivan | 2015-02-03 |
| 8937009 | Far back end of the line metallization method and structures | Timothy H. Daubenspeck, Jeffrey P. Gambino, Karen P. McLaughlin, Ekta Misra, Eric D. Perfecto +1 more | 2015-01-20 |
| 8933540 | Thermal via for 3D integrated circuits structures | Timothy H. Daubenspeck, Jeffrey P. Gambino, Michael J. Hauser, Wolfgang Sauter, Timothy D. Sullivan | 2015-01-13 |
| 8927869 | Semiconductor structures and methods of manufacture | Timothy H. Daubenspeck, Jeffrey P. Gambino, Zhong-Xiang He, Wolfgang Sauter, Timothy D. Sullivan | 2015-01-06 |
| 8927334 | Overcoming chip warping to enhance wetting of solder bumps and flip chip attaches in a flip chip package | Timothy H. Daubenspeck, Jeffrey P. Gambino, Nathalie Normand, David L. Questad, Wolfgang Sauter +1 more | 2015-01-06 |
| 8916463 | Wire bond splash containment | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2014-12-23 |
| 8916464 | Structures and methods for improving solder bump connections in semiconductor devices | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan | 2014-12-23 |
| 8819933 | Method for forming a current distribution structure | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2014-09-02 |
| 8809182 | Pad cushion structure and method of fabrication for Pb-free C4 integrated circuit chip joining | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2014-08-19 |
| 8778792 | Solder bump connections | Timothy H. Daubenspeck, Jeffrey P. Gambino, Ekta Misra, Wolfgang Sauter, George J. Scott | 2014-07-15 |
| 8766439 | Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan | 2014-07-01 |
| 8742594 | Structure and method of making an offset-trench crackstop that forms an air gap adjacent to a passivated metal crackstop | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2014-06-03 |
| 8680675 | Structures and methods for improving solder bump connections in semiconductor devices | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan | 2014-03-25 |
| 8637392 | Solder interconnect with non-wettable sidewall pillars and methods of manufacture | Charles L. Arvin, Raschid J. Bezama, Timothy H. Daubenspeck, Jeffrey P. Gambino, David L. Questad +3 more | 2014-01-28 |
| 8629557 | Structures and methods for detecting solder wetting of pedestal sidewalls | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan | 2014-01-14 |
| 8580673 | Underfill flow guide structures and method of using same | Timothy H. Daubenspeck, Jeffrey P. Gambino, Marie-Claude Paquet, Wolfgang Sauter, Timothy D. Sullivan | 2013-11-12 |
| 8575007 | Selective electromigration improvement for high current C4s | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Thomas A. Wassick | 2013-11-05 |
| 8546253 | Self-aligned polymer passivation/aluminum pad | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan | 2013-10-01 |
| 8513814 | Buffer pad in solder bump connections and methods of manufacture | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan | 2013-08-20 |
| 8508043 | Metal pad structure for thickness enhancement of polymer used in electrical interconnection of semiconductor die to semiconductor chip package substrate with solder bump | Timothy H. Daubenspeck, Jeffrey P. Gambino, David L. Questad, Wolfgang Sauter, Timothy D. Sullivan | 2013-08-13 |
| 8492267 | Pillar interconnect chip to package and global wiring structure | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2013-07-23 |
| 8492892 | Solder bump connections | Timothy H. Daubenspeck, Jeffrey P. Gambino, Ekta Misra, Wolfgang Sauter, George J. Scott | 2013-07-23 |
| 8476762 | Ni plating of a BLM edge for Pb-free C4 undercut control | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2013-07-02 |