Issued Patents All Time
Showing 76–100 of 140 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8426247 | Polymer and solder pillars for connecting chip and carrier | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan | 2013-04-23 |
| 8409980 | Underfill flow guide structures and method of using same | Timothy H. Daubenspeck, Jeffrey P. Gambino, Marie-Claude Paquet, Wolfgang Sauter, Timothy D. Sullivan | 2013-04-02 |
| 8373275 | Fine pitch solder bump structure with built-in stress buffer | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2013-02-12 |
| 8361598 | Substrate anchor structure and method | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2013-01-29 |
| 8350383 | IC chip package having IC chip with overhang and/or BGA blocking underfill material flow and related methods | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan | 2013-01-08 |
| 8299568 | Damage propagation barrier | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2012-10-30 |
| 8298930 | Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof | Charles L. Arvin, Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2012-10-30 |
| 8288747 | Optoelectronic memory devices | Fen Chen, Richard S. Kontra, Tom C. Lee, Theodore M. Levin, Timothy D. Sullivan | 2012-10-16 |
| 8242012 | Integrated circuit structure incorporating a conductor layer with both top surface and sidewall passivation and a method of forming the integrated circuit structure | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan | 2012-08-14 |
| 8237279 | Collar structure around solder balls that connect semiconductor die to semiconductor chip package substrate | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan | 2012-08-07 |
| 8227333 | Ni plating of a BLM edge for Pb-free C4 undercut control | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2012-07-24 |
| 8198133 | Structures and methods to improve lead-free C4 interconnect reliability | Timothy H. Daubenspeck, Paul F. Fortier, Jeffrey P. Gambino, David L. Questad, Wolfgang Sauter +1 more | 2012-06-12 |
| 8164188 | Methods of forming solder connections and structure thereof | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2012-04-24 |
| 8159067 | Underfill flow guide structures | Timothy H. Daubenspeck, Jeffrey P. Gambino, Marie-Claude Paquet, Wolfgang Sauter, Timothy D. Sullivan | 2012-04-17 |
| 8138099 | Chip package solder interconnect formed by surface tension | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan | 2012-03-20 |
| 8114767 | Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Jeffrey S. Zimmerman | 2012-02-14 |
| 7989358 | Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch | Timothy H. Daubenspeck, Jeffrey P. Gambino, Jerome B. Lasky, Wolfgang Sauter | 2011-08-02 |
| 7985671 | Structures and methods for improving solder bump connections in semiconductor devices | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan | 2011-07-26 |
| 7981732 | Programming of laser fuse | Dinesh A. Badami, Tom C. Lee, Baozhen Li, Gerald Matusiewicz, William T. Motsiff +2 more | 2011-07-19 |
| 7958477 | Structure, failure analysis tool and method of determining white bump location using failure analysis tool | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Jeffrey S. Zimmerman | 2011-06-07 |
| 7939390 | Gap capacitors for monitoring stress in solder balls in flip chip technology | Stephen P. Ayotte, Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2011-05-10 |
| 7935408 | Substrate anchor structure and method | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2011-05-03 |
| 7911803 | Current distribution structure and method | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2011-03-22 |
| 7910408 | Damage propagation barrier and method of forming | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2011-03-22 |
| 7871919 | Structures and methods for improving solder bump connections in semiconductor devices | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan | 2011-01-18 |