CM

Christopher D. Muzzy

IBM: 121 patents #407 of 70,183Top 1%
Globalfoundries: 18 patents #182 of 4,424Top 5%
UL Ultratech: 1 patents #58 of 110Top 55%
📍 Burlington, VT: #4 of 475 inventorsTop 1%
🗺 Vermont: #36 of 4,968 inventorsTop 1%
Overall (All Time): #7,189 of 4,157,543Top 1%
140
Patents All Time

Issued Patents All Time

Showing 126–140 of 140 patents

Patent #TitleCo-InventorsDate
7405139 Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch Timothy H. Daubenspeck, Jeffrey P. Gambino, Jerome B. Lasky, Wolfgang Sauter 2008-07-29
7384824 Structure and programming of laser fuse Dinesh A. Badami, Tom C. Lee, Baozhen Li, Gerald Matusiewicz, William T. Motsiff +2 more 2008-06-10
7348210 Post bump passivation for soft error protection Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Edmund J. Sprogis 2008-03-25
7329951 Solder bumps in flip-chip technologies Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter 2008-02-12
7323780 Electrical interconnection structure formation Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter 2008-01-29
7316971 Wire bond pads Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter 2008-01-08
7316940 Chip dicing Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter 2008-01-08
7256503 Chip underfill in flip-chip technologies Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, David L. Questad 2007-08-14
7232695 Method and apparatus for completely covering a wafer with a passivating material Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Jeffrey S. Zimmerman 2007-06-19
7176583 Damascene patterning of barrier layer metal for C4 solder bumps Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter 2007-02-13
7112470 Chip dicing Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter 2006-09-26
7064409 Structure and programming of laser fuse Dinesh A. Badami, Tom C. Lee, Baozhen Li, Gerald Matusiewicz, William T. Motsiff +2 more 2006-06-20
6924210 Chip dicing Timothy H. Daubenspeck, William T. Motsiff, Wolfgang Sauter 2005-08-02
6876058 Wiring protection element for laser deleted tungsten fuse William T. Motsiff 2005-04-05
6815838 Laser alignment target and method Timothy H. Daubenspeck, Richard A. Gilmour, William T. Motsiff 2004-11-09