Issued Patents All Time
Showing 101–125 of 140 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7871920 | Semiconductor chips with reduced stress from underfill at edge of chip | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2011-01-18 |
| 7862987 | Method for forming an electrical structure comprising multiple photosensitive materials | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2011-01-04 |
| 7863734 | Dual-sided chip attached modules | Kerry Bernstein, Timothy J. Dalton, Timothy H. Daubenspeck, Jeffrey P. Gambino, Mark D. Jaffe +3 more | 2011-01-04 |
| 7859122 | Final via structures for bond pad-solder ball interconnections | Timothy H. Daubenspeck, Jeffrey P. Gambino, David L. Questad, Wolfgang Sauter | 2010-12-28 |
| 7843069 | Wire bond pads | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2010-11-30 |
| 7825511 | Undercut-free BLM process for Pb-free and Pb-reduced C4 | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2010-11-02 |
| 7777339 | Semiconductor chips with reduced stress from underfill at edge of chip | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2010-08-17 |
| 7768815 | Optoelectronic memory devices | Fen Chen, Richard S. Kontra, Tom C. Lee, Theodore M. Levin, Timothy D. Sullivan | 2010-08-03 |
| 7709876 | Gap capacitors for monitoring stress in solder balls in flip chip technology | Stephen P. Ayotte, Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2010-05-04 |
| 7704804 | Method of forming a crack stop laser fuse with fixed passivation layer coverage | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2010-04-27 |
| 7701035 | Laser fuse structures for high power applications | Stephen E. Greco, Erik L. Hedberg, Dae Young Jung, Paul S. McLaughlin, Norman J. Rohrer +1 more | 2010-04-20 |
| 7682961 | Methods of forming solder connections and structure thereof | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2010-03-23 |
| 7635643 | Method for forming C4 connections on integrated circuit chips and the resulting devices | Timothy H. Daubenspeck, Mukta G. Farooq, Jeffrey P. Gambino, Kevin S. Petrarca, Wolfgang Sauter | 2009-12-22 |
| 7614147 | Method of creating contour structures to highlight inspection region | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2009-11-10 |
| 7601628 | Wire and solder bond forming methods | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2009-10-13 |
| 7547576 | Solder wall structure in flip-chip technologies | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2009-06-16 |
| 7541272 | Damascene patterning of barrier layer metal for C4 solder bumps | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2009-06-02 |
| 7521287 | Wire and solder bond forming methods | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2009-04-21 |
| 7517789 | Solder bumps in flip-chip technologies | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2009-04-14 |
| 7485564 | Undercut-free BLM process for Pb-free and Pb-reduced C4 | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2009-02-03 |
| 7482675 | Probing pads in kerf area for wafer testing | James W. Adkisson, Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2009-01-27 |
| 7479447 | Method of forming a crack stop void in a low-k dielectric layer between adjacent fuses | Timothy H. Daubenspeck, Paul S. McLaughlin, Judith A. Wright, Jean Wynne, Dae Young Jung | 2009-01-20 |
| 7462509 | Dual-sided chip attached modules | Kerry Bernstein, Timothy J. Dalton, Timothy H. Daubenspeck, Jeffrey P. Gambino, Mark D. Jaffe +3 more | 2008-12-09 |
| 7459785 | Electrical interconnection structure formation | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2008-12-02 |
| 7411135 | Contour structures to highlight inspection regions | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter | 2008-08-12 |