Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Structures and methods to enable a full intermetallic interconnect

Structures and methods to enable a full intermetallic interconnect

US Patent 9911711 · Granted Mar 6, 2018

Estimated economic value: $2,330,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Clip applier2025
Electronic package with varying interconnects2024
Lateral escape using triangular structure of transceivers2024
High bandwidth module2023
Near tier decoupling capacitors2023
Spacer for die-to-die communication in an integrated circuit and method for fabr2022
Polygon integrated circuit (IC) packaging2022
Direct attachment of capacitors to flip chip dies2022
Alignment carrier for interconnect bridge assembly2022
Thin film capacitors for core and adjacent build up layers2022
Enlarged conductive pad structures for enhanced chip bond assembly yield2022
Partitioned substrates with interconnect bridge2022