Issued Patents All Time
Showing 26–50 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9006739 | Semiconductor test and monitoring structure to detect boundaries of safe effective modulus | James V. Crain, Jr., Mark C. H. Lamorey, Christopher D. Muzzy, David B. Stone | 2015-04-14 |
| 8859390 | Structure and method for making crack stop for 3D integrated circuits | Mukta G. Farooq, John A. Griesemer, William Francis Landers, Ian D. Melville, Huilong Zhu | 2014-10-14 |
| 8841212 | Method of making a copper interconnect having a barrier liner of multiple metal layers | Takeshi Nogami, Andrew H. Simon, Jean Wynne, Chih-Chao Yang | 2014-09-23 |
| 8796133 | Optimization metallization for prevention of dielectric cracking under controlled collapse chip connections | Griselda Bonilla, Timothy H. Daubenspeck, Mark C. H. Lamorey, Howard S. Landis, Xiao Hu Liu +2 more | 2014-08-05 |
| 8796854 | Hybrid interconnect structure for performance improvement and reliability enhancement | Chih-Chao Yang, Keith Kwong Hon Wong, Haining Yang | 2014-08-05 |
| 8754526 | Hybrid interconnect structure for performance improvement and reliability enhancement | Chih-Chao Yang, Keith Kwong Hon Wong, Haining Yang | 2014-06-17 |
| 8753979 | Hybrid interconnect structure for performance improvement and reliability enhancement | Chih-Chao Yang, Keith Kwong Hon Wong, Haining Yang | 2014-06-17 |
| 8650512 | Elastic modulus mapping of an integrated circuit chip in a chip/device package | Timothy H. Daubenspeck, Mark C. H. Lamorey, Xiao Hu Liu, Thomas A. Wassick | 2014-02-11 |
| 8592306 | Redundant metal barrier structure for interconnect applications | Chih-Chao Yang | 2013-11-26 |
| 8456006 | Hybrid interconnect structure for performance improvement and reliability enhancement | Chih-Chao Yang, Keith Kwong Hon Wong, Haining Yang | 2013-06-04 |
| 8362596 | Engineered interconnect dielectric caps having compressive stress and interconnect structures containing same | Stephan A. Cohen, Alfred Grill, Thomas J. Haigh, Jr., Xiao Hu Liu, Son V. Nguyen +1 more | 2013-01-29 |
| 8343868 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2013-01-01 |
| 8242600 | Redundant metal barrier structure for interconnect applications | Chih-Chao Yang | 2012-08-14 |
| 8129286 | Reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2012-03-06 |
| 8076756 | Structure for inhibiting back end of line damage from dicing and chip packaging interaction failures | Michael Lane, Xiao Hu Liu, Mukta G. Farooq, Robert Hannon, Ian D. Melville | 2011-12-13 |
| 7972965 | Process for interfacial adhesion in laminate structures through patterned roughing of a surface | Edward C. Cooney, III, Vincent J. McGahay, Anthony K. Stamper, Matthew E. Colburn | 2011-07-05 |
| 7973409 | Hybrid interconnect structure for performance improvement and reliability enhancement | Chih-Chao Yang, Keith Kwong Hon Wong, Haining Yang | 2011-07-05 |
| 7955955 | Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures | Michael Lane, Xiao Hu Liu, Mukta G. Farooq, Robert Hannon, Ian D. Melville | 2011-06-07 |
| 7892940 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2011-02-22 |
| 7847402 | BEOL interconnect structures with improved resistance to stress | Darryl D. Restaino, Griselda Bonilla, Christos D. Dimitrakopoulos, Stephen M. Gates, Jae Hak Kim +4 more | 2010-12-07 |
| 7820559 | Structure to improve adhesion between top CVD low-K dielectric and dielectric capping layer | Lawrence A. Clevenger, Stefanie Chiras, Timothy J. Dalton, James J. Demarest, Darren N. Dunn +7 more | 2010-10-26 |
| 7745863 | Flip FERAM cell and method to form same | James W. Adkisson, Charles T. Black, Alfred Grill, Randy W. Mann, Deborah A. Neumayer +2 more | 2010-06-29 |
| 7678673 | Strengthening of a structure by infiltration | Elbert E. Huang, William Francis Landers, Michael Lane, Eric G. Liniger, Xiao Hu Liu +1 more | 2010-03-16 |
| 7592685 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2009-09-22 |
| 7573130 | Crack trapping and arrest in thin film structures | Michael Lane, Xio Hu Liu, Griselda Bonilla, James P. Doyle, Howard S. Landis +1 more | 2009-08-11 |