TS

Thomas M. Shaw

IBM: 85 patents #762 of 70,183Top 2%
Globalfoundries: 3 patents #1,029 of 4,424Top 25%
CM Chartered Semiconductor Manufacturing: 1 patents #419 of 840Top 50%
Samsung: 1 patents #49,284 of 75,807Top 70%
📍 Peekskill, NY: #2 of 232 inventorsTop 1%
🗺 New York: #724 of 115,490 inventorsTop 1%
Overall (All Time): #18,844 of 4,157,543Top 1%
88
Patents All Time

Issued Patents All Time

Showing 76–88 of 88 patents

Patent #TitleCo-InventorsDate
6503641 Interconnects with Ti-containing liners Cyril Cabral, Jr., Roy A. Carruthers, James M. E. Harper, Chao-Kun Hu, Kim Y. Lee +2 more 2003-01-07
6417572 Process for producing metal interconnections and product produced thereby Dureseti Chidambarrao, Ronald G. Filippi, Robert Rosenberg, Timothy D. Sullivan, Richard A. Wachnik 2002-07-09
6388285 Feram cell with internal oxygen source and method of oxygen release Charles T. Black, Cyril Cabral, Jr., Alfred Grill, Deborah A. Neumayer, Wilbur D. Pricer +1 more 2002-05-14
6333202 Flip FERAM cell and method to form same James W. Adkisson, Charles T. Black, Alfred Grill, Randy W. Mann, Deborah A. Neumayer +2 more 2001-12-25
6271076 Method for fabricating a novel metallized oxide structure Robert Benjamin Laibowitz, Joseph M. Viggiano 2001-08-07
6255122 Amorphous dielectric capacitors on silicon Peter Richard Duncombe, Robert Benjamin Laibowitz, Deborah A. Neumayer 2001-07-03
6211543 Lead silicate based capacitor structures Robert Benjamin Laibowitz 2001-04-03
6202191 Electromigration resistant power distribution network Ronald G. Filippi, Phillip Lin, Richard A. Wachnik 2001-03-13
6090659 Lead silicate based capacitor structures Robert Benjamin Laibowitz 2000-07-18
6088216 Lead silicate based capacitor structures Robert Benjamin Laibowitz 2000-07-11
5926360 Metallized oxide structure and fabrication Robert Benjamin Laibowitz, Joseph M. Viggiano 1999-07-20
5337475 Process for producing ceramic circuit structures having conductive vias Farid Youssif Aoude, Emanuel I. Cooper, Peter Richard Duncombe, Shaji Farooq, Edward A. Giess +12 more 1994-08-16
5283104 Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates Farid Youssif Aoude, Emanuel I. Cooper, Peter Richard Duncombe, Shaji Farooq, Edward A. Giess +12 more 1994-02-01