Issued Patents All Time
Showing 51–75 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7491578 | Method of forming crack trapping and arrest in thin film structures | Michael Lane, Xio Hu Liu, Griselda Bonilla, James P. Doyle, Howard S. Landis +1 more | 2009-02-17 |
| 7485582 | Hardmask for improved reliability of silicon based dielectrics | Son V. Nguyen, Michael Lane, Stephen M. Gates, Xiao Hu Liu, Vincent J. McGahay +1 more | 2009-02-03 |
| 7456098 | Building metal pillars in a chip for structure support | Habib Hichri, Xiao Hu Liu, Vincent J. McGahay, Conal E. Murray, Jawahar P. Nayak | 2008-11-25 |
| 7405147 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2008-07-29 |
| 7402532 | Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer | Lawrence A. Clevenger, Stefanie Chiras, Timothy J. Dalton, James J. Demarest, Derren N. Dunn +7 more | 2008-07-22 |
| 7402857 | Flip FERAM cell and method to form same | James W. Adkisson, Charles T. Black, Alfred Grill, Randy W. Mann, Deborah A. Neumayer +2 more | 2008-07-22 |
| 7388224 | Structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Paul S. McLaughlin, Conal E. Murray +2 more | 2008-06-17 |
| 7381659 | Method for reducing film stress for SiCOH low-k dielectric materials | Son V. Nguyen | 2008-06-03 |
| 7357977 | Ultralow dielectric constant layer with controlled biaxial stress | Christos D. Dimitrakopoulos, Stephen M. Gates, Alfred Grill, Michael Lane, Eric G. Liniger +3 more | 2008-04-15 |
| 7345305 | Control of liner thickness for improving thermal cycle reliability | Ronald G. Filippi, Lynne M. Gignac, Vincent J. McGahay, Conal E. Murray, Hazara S. Rathore +1 more | 2008-03-18 |
| 7335980 | Hardmask for reliability of silicon based dielectrics | Son V. Nguyen, Michael Lane, Stephen M. Gates, Xiao Hu Liu, Vincent J. McGahay +1 more | 2008-02-26 |
| 7303994 | Process for interfacial adhesion in laminate structures through patterned roughing of a surface | Edward C. Cooney, III, Vincent J. McGahay, Anthony K. Stamper, Matthew E. Colburn | 2007-12-04 |
| 7260810 | Method of extracting properties of back end of line (BEOL) chip architecture | Ronald G. Filippi, Giovanni Fiorenza, Xiao Hu Liu, Conal E. Murray, Gregory A. Northrop +2 more | 2007-08-21 |
| 7217969 | Flip FERAM cell and method to form same | James W. Adkisson, Charles T. Black, Alfred Grill, Randy W. Mann, Deborah A. Neumayer +2 more | 2007-05-15 |
| 7186573 | Flip FERAM cell and method to form same | James W. Adkisson, Charles T. Black, Alfred Grill, Randy W. Mann, Deborah A. Neumayer +2 more | 2007-03-06 |
| 7109093 | Crackstop with release layer for crack control in semiconductors | John A. Fitzsimmons, Michael Lane, Vincent J. McGahay, Anthony K. Stamper | 2006-09-19 |
| 7102232 | Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer | Lawrence A. Clevenger, Stefanie Chiras, Timothy J. Dalton, James J. Demarest, Derren N. Dunn +7 more | 2006-09-05 |
| 7098676 | Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor | William Francis Landers, Diana Llera-Hurlburt, Scott W. Crowder, Vincent J. McGahay, Sandra G. Malhotra +3 more | 2006-08-29 |
| 7098054 | Method and structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Paul S. McLaughlin, Conal E. Murray +2 more | 2006-08-29 |
| 7067902 | Building metal pillars in a chip for structure support | Habib Hichri, Xiao Hu Liu, Vincent J. McGahay, Conal E. Murray, Jawahar P. Nayak | 2006-06-27 |
| 6989282 | Control of liner thickness for improving thermal cycle reliability | Ronald G. Filippi, Lynne M. Gignac, Vincent J. McGahay, Conal E. Murray, Hazara S. Rathore +1 more | 2006-01-24 |
| 6972209 | Stacked via-stud with improved reliability in copper metallurgy | Birendra Agarwala, Conrad A. Barile, Hormazdyar M. Dalal, Brett H. Engle, Michael Lane +8 more | 2005-12-06 |
| 6815343 | Gas treatment of thin film structures with catalytic action | John David Baniecki, Robert Benjamin Laibowitz, Christopher C. Parks | 2004-11-09 |
| 6773982 | Feram cell with internal oxygen source and method of oxygen release | Charles T. Black, Cyril Cabral, Jr., Alfred Grill, Deborah A. Neumayer, Wilbur D. Pricer +1 more | 2004-08-10 |
| 6555859 | Flip FERAM cell and method to form same | James W. Adkisson, Charles T. Black, Alfred Grill, Randy W. Mann, Deborah A. Neumayer +2 more | 2003-04-29 |