Issued Patents All Time
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6414377 | Low k dielectric materials with inherent copper ion migration barrier | Claudius Feger, Jeffrey Hedrick, Jane M. Shaw | 2002-07-02 |
| 6184121 | Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same | Leena Paivikki Buchwalter, Alessandro C. Callegari, Teresita O. Graham, John P. Hummel, Christopher V. Jahnes +3 more | 2001-02-06 |
| 6014310 | High dielectric TiO.sub.2 -SiN composite films for memory applications | Gary B. Bronner, David M. Dobuzinsky, Jeffrey P. Gambino, Herbert L. Ho, Karen P. Madden | 2000-01-11 |
| 5876788 | High dielectric TiO.sub.2 -SiN composite films for memory applications | Gary B. Bronner, David M. Dobuzinsky, Jeffrey P. Gambino, Herbert L. Ho, Karen P. Madden | 1999-03-02 |
| 5679269 | Diamond-like carbon for use in VLSI and ULSI interconnect systems | Daniel C. Edelstein, Alfred Grill, Jurij R. Paraszczak, Vishnubhai V. Patel | 1997-10-21 |
| 5674355 | Diamond-like carbon for use in VLSI and ULSI interconnect systems | Daniel C. Edelstein, Alfred Grill, Jurij R. Paraszczak, Vishnubhai V. Patel | 1997-10-07 |
| 5530293 | Carbon-free hydrogen silsesquioxane with dielectric constant less than 3.2 annealed in hydrogen for integrated circuits | Vincent J. McGahay, Ronald R. Uttecht | 1996-06-25 |