Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof

Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof

US Patent 6737747 · Granted May 18, 2004

Estimated economic value: $9,414,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Anti-fuse and fuse structures for improving the functionality of qubit circuits2025
Anti-fuse and fuse structures for improving the functionality of qubit circuits2025
Layered substrate structures with aligned optical access to electrical devices2024
Method to form air gap structure with dual dielectric layer2023
Manufacturing method for an artificially oriented piezoelectric film for integra2023
Microwave-to-optical quantum transducers2023
Dual dielectric layer for closing seam in air gap structure2021
SOI wafers with buried dielectric layers to prevent CU diffusion2021
Vertically integrated active matrix backplane2020
Seal ring structure of integrated circuit and method of forming same2020
Time temperature monitoring system2019
Artificially oriented piezoelectric film for integrated filters2019