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Benjamin C. Backes, Brian Alexander Cohen, Carl Radens |
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Self-aligned via interconnect structures |
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Self-aligned via interconnect structures |
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Low-loss large-grain optical waveguide for interconnecting components integrated on a glass substrate |
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2017-06-13 |
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Laser anneal of buried metallic interconnects including through silicon vias |
Oleg Gluschenkov, Andrew J. Martin |
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Integrated circuit barrierless microfluidic channel |
Lawrence A. Clevenger, Vincent J. McGahay, Yiheng Xu |
2016-11-22 |
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Low-loss large-grain optical waveguide for interconnecting components integrated on a glass substrate |
Stephen M. Gates, Jason S. Orcutt, Jean-Olivier Plouchart, Spyridon Skordas |
2016-10-18 |
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Laser anneal of buried metallic interconnects including through silicon vias |
Oleg Gluschenkov, Andrew J. Martin |
2016-09-27 |
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2016-08-09 |
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Constrained nanosecond laser anneal of metal interconnect structures |
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Integrated circuit barrierless microfluidic channel |
Lawrence A. Clevenger, Vincent J. McGahay, Yiheng Xu |
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Integrated circuit barrierless microfluidic channel |
Lawrence A. Clevenger, Vincent J. McGahay, Yiheng Xu |
2016-06-21 |
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Methods to form conductive thin film structures |
Lawrence A. Clevenger, Vincent J. McGahay, Yiheng Xu |
2016-06-07 |
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Hardmask removal for copper interconnects with tungsten contacts by chemical mechanical polishing |
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2016-03-22 |
