Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6477447 | Methods to generate numerical pressure distribution data for developing pressure related components | — | 2002-11-05 |
| 6441465 | Scribe line structure for preventing from damages thereof induced during fabrication | Wei-Tsu Tseng, Min Feng | 2002-08-27 |
| 6323122 | Structure for a multi-layered dielectric layer and manufacturing method thereof | — | 2001-11-27 |
| 6307268 | Suppression of interconnect stress migration by refractory metal plug | — | 2001-10-23 |
| 6277757 | Methods to modify wet by dry etched via profile | — | 2001-08-21 |
| 6235608 | STI process by method of in-situ multilayer dielectric deposition | Wei-Tsu Tseng, Min Feng | 2001-05-22 |
| 6204551 | Modified SOG coater's hot plate to improve SOG film quality | — | 2001-03-20 |
| 6180997 | Structure for a multi-layered dielectric layer and manufacturing method thereof | — | 2001-01-30 |
| 6165886 | Advanced IC bonding pad design for preventing stress induced passivation cracking and pad delimitation through stress bumper pattern and dielectric pin-on effect | Wei-Tsu Tseng, Min Feng | 2000-12-26 |
| 6033987 | Method for mapping and adjusting pressure distribution of CMP processes | Wen-Tsu Tseng, Min Feng | 2000-03-07 |
| 5969409 | Combined in-situ high density plasma enhanced chemical vapor deposition (HDPCVD) and chemical mechanical polishing (CMP) process to form an intermetal dielectric layer with a stopper layer embedded therein | — | 1999-10-19 |
| 5946592 | Combined in-situ high density plasma enhanced chemical vapor deposition (HDPCVD) and chemical mechanical polishing (CMP) process to form an intermetal dielectric layer with a stopper layer embedded therein | — | 1999-08-31 |
| 5920792 | High density plasma enhanced chemical vapor deposition process in combination with chemical mechanical polishing process for preparation and planarization of intemetal dielectric layers | — | 1999-07-06 |