| 9385038 |
Selective local metal cap layer formation for improved electromigration behavior |
Matthew S. Angyal, Junjing Bao, Griselda Bonilla, Samuel S. Choi, James A. Culp +4 more |
2016-07-05 |
| 9360525 |
Stacked via structure for metal fuse applications |
Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Stephan Grunow, Andrew H. Simon +1 more |
2016-06-07 |
| 9324655 |
Modified via bottom for beol via efuse |
Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Andrew H. Simon |
2016-04-26 |
| 9293412 |
Graphene and metal interconnects with reduced contact resistance |
Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Andrew H. Simon |
2016-03-22 |
| 9257391 |
Hybrid graphene-metal interconnect structures |
Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Andrew H. Simon |
2016-02-09 |
| 9202743 |
Graphene and metal interconnects |
Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Andrew H. Simon |
2015-12-01 |
| 9171801 |
E-fuse with hybrid metallization |
Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Andrew H. Simon |
2015-10-27 |
| 9142506 |
E-fuse structures and methods of manufacture |
Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Stephan Grunow +1 more |
2015-09-22 |
| 9105638 |
Via-fuse with low dielectric constant |
Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Wai-Kin Li +1 more |
2015-08-11 |
| 9105637 |
Anti-fuse structure and fabrication |
Ronald G. Filippi, Ping-Chuan Wang, Lijuan Zhang |
2015-08-11 |
| 9099468 |
Electronic fuse vias in interconnect structures |
Junjing Bao, Griselda Bonilla, Samuel S. Choi, Daniel C. Edelstein, Ronald G. Filippi +1 more |
2015-08-04 |
| 9093164 |
Redundant via structure for metal fuse applications |
Ronald G. Filippi, Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Stephan Grunow +1 more |
2015-07-28 |
| 9093452 |
Electronic fuse with resistive heater |
Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Wai-Kin Li +1 more |
2015-07-28 |
| 9076847 |
Selective local metal cap layer formation for improved electromigration behavior |
Matthew S. Angyal, Junjing Bao, Griselda Bonilla, Samuel S. Choi, James A. Culp +4 more |
2015-07-07 |
| 9059169 |
E-fuse structures and methods of manufacture |
Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Stephan Grunow +1 more |
2015-06-16 |
| 9059170 |
Electronic fuse having a damaged region |
Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Wai-Kin Li +4 more |
2015-06-16 |
| 9034664 |
Method to resolve hollow metal defects in interconnects |
Griselda Bonilla, Junjing Bao, Samuel S. Choi, Ronald G. Filippi, Andrew H. Simon |
2015-05-19 |
| 8962467 |
Metal fuse structure for improved programming capability |
Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Stephan Grunow +2 more |
2015-02-24 |
| 8921167 |
Modified via bottom for BEOL via efuse |
Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Andrew H. Simon |
2014-12-30 |
| 8916461 |
Electronic fuse vias in interconnect structures |
Junjing Bao, Griselda Bonilla, Samuel S. Choi, Daniel C. Edelstein, Ronald G. Filippi +1 more |
2014-12-23 |
| 8836124 |
Fuse and integrated conductor |
Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Stephan Grunow +1 more |
2014-09-16 |
| 8742766 |
Stacked via structure for metal fuse applications |
Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Stephan Grunow, Andrew H. Simon +1 more |
2014-06-03 |
| 8736020 |
Electronic anti-fuse |
Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Andrew H. Simon |
2014-05-27 |
| 8633707 |
Stacked via structure for metal fuse applications |
Ronald G. Filippi, Griselda Bonilla, Kaushik Chanda, Stephan Grunow, Andrew H. Simon +1 more |
2014-01-21 |
| 8384219 |
Semiconductor having interconnects with improved mechanical properties by insertion of nanoparticles |
Junjing Bao, Tien-Jen Cheng |
2013-02-26 |
