NL

Naftali E. Lustig

IBM: 58 patents #1,384 of 70,183Top 2%
Globalfoundries: 9 patents #393 of 4,424Top 9%
GU Globalfoundries U.S.: 1 patents #22 of 211Top 15%
📍 Ossining, NY: #23 of 613 inventorsTop 4%
🗺 New York: #1,127 of 115,490 inventorsTop 1%
Overall (All Time): #31,105 of 4,157,543Top 1%
68
Patents All Time

Issued Patents All Time

Showing 51–68 of 68 patents

Patent #TitleCo-InventorsDate
8232646 Interconnect structure for integrated circuits having enhanced electromigration resistance Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Stephan Grunow, Chao-Kun Hu +2 more 2012-07-31
8129269 Method of improving mechanical properties of semiconductor interconnects with nanoparticles Junjing Bao, Tien-Jen Cheng 2012-03-06
8030707 Semiconductor structure Kangguo Cheng, Daewon Yang 2011-10-04
7488679 Interconnect structure and process of making the same Theodorus E. Standaert, Pegeen M. Davis, John A. Fitzsimmons, Stephen E. Greco, Tze-man Ko +2 more 2009-02-10
6933191 Two-mask process for metal-insulator-metal capacitors and single mask process for thin film resistors Glenn A. Biery, Zheng Chen, Timothy J. Dalton 2005-08-23
6743268 Chemical-mechanical planarization of barriers or liners for copper metallurgy William J. Cote, Daniel C. Edelstein 2004-06-01
6632377 Chemical-mechanical planarization of metallurgy Vlasta Brusic, Daniel C. Edelstein, Paul M. Feeney, William L. Guthrie, Mark A. Jaso +4 more 2003-10-14
6573606 Chip to wiring interface with single metal alloy layer applied to surface of copper interconnect Carlos J. Sambucetti, Xiaomeng Chen, Soon-Cheon Seo, Birenda Nath Agarwala, Chao-Kun Hu +1 more 2003-06-03
6375693 Chemical-mechanical planarization of barriers or liners for copper metallurgy William J. Cote, Daniel C. Edelstein 2002-04-23
6153043 Elimination of photo-induced electrochemical dissolution in chemical mechanical polishing Daniel C. Edelstein, Wilma Jean Horkans, Stephen E. Luce, Keith R. Pope, Peter D. Roper 2000-11-28
6020264 Method and apparatus for in-line oxide thickness determination in chemical-mechanical polishing William L. Guthrie, Thomas E. Sandwick 2000-02-01
5633195 Laser planarization of zone 1 deposited metal films for submicron metal interconnects William L. Guthrie 1997-05-27
5569501 Diamond-like carbon films from a hydrocarbon helium plasma Fredric D. Bailey, Douglas A. Buchanan, Alessandro C. Callegari, Howard M. Clearfield, Fuad E. Doany +8 more 1996-10-29
5470661 Diamond-like carbon films from a hydrocarbon helium plasma Fredric D. Bailey, Douglas A. Buchanan, Alessandro C. Callegari, Howard M. Clearfield, Fuad E. Doany +8 more 1995-11-28
5433651 In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing Katherine L. Saenger, Ho-Ming Tong 1995-07-18
5358899 Oxygen assisted ohmic contact formation to n-type gallium arsenide Aaron Fleischman, Robert G. Schad 1994-10-25
5337015 In-situ endpoint detection method and apparatus for chemical-mechanical polishing using low amplitude input voltage Randall M. Feenstra, William L. Guthrie 1994-08-09
5317190 Oxygen assisted ohmic contact formation to N-type gallium arsenide Aaron Fleischman, Robert G. Schad 1994-05-31