Issued Patents All Time
Showing 101–125 of 201 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10629529 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny | 2020-04-21 |
| 10622406 | Dual metal nitride landing pad for MRAM devices | Alexander Reznicek, Oscar van der Straten | 2020-04-14 |
| 10615119 | Back end of line electrical fuse structure and method of fabrication | Benjamin D. Briggs, Lawrence A. Clevenger, Chih-Chao Yang | 2020-04-07 |
| 10606231 | Computer-mediated reality including physical damping feedback | Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christopher J. Penny, Aldis Sipolins | 2020-03-31 |
| 10593506 | Fold over emitter and collector field emission transistor | Benjamin D. Briggs, Lawrence A. Clevenger | 2020-03-17 |
| 10586767 | Hybrid BEOL metallization utilizing selective reflection mask | Benjamin D. Briggs, Cornelius Brown Peethala, Koichi Motoyama, Gen Tsutsui, Ruqiang Bao +2 more | 2020-03-10 |
| 10585998 | Automated method for integrated analysis of back end of the line yield, line resistance/capacitance and process performance | Prasad Bhosale, Chih-Chao Yang | 2020-03-10 |
| 10580740 | Low-temperature diffusion doping of copper interconnects independent of seed layer composition | Benjamin D. Briggs, Lawrence A. Clevenger, Chao-Kun Hu, Takeshi Nogami, Deepika Priyadarshini | 2020-03-03 |
| 10559498 | Location-specific laser annealing to improve interconnect microstructure | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo | 2020-02-11 |
| 10546892 | Resistive memory device with meshed electrodes | Takashi Ando, Lawrence A. Clevenger, Chih-Chao Yang | 2020-01-28 |
| 10545806 | Proximity correction in three-dimensional manufacturing | Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christopher J. Penny, Aldis Sipolins | 2020-01-28 |
| 10541206 | Interconnect structure including air gaps enclosed between conductive lines and a permeable dielectric layer | Benjamin D. Briggs, Lawrence A. Clevenger, Christopher J. Penny | 2020-01-21 |
| 10529662 | Method and structure to construct cylindrical interconnects to reduce resistance | Benjamin D. Briggs, Christopher J. Penny, Huai Huang, Lawrence A. Clevenger, Hosadurga Shobha | 2020-01-07 |
| 10529621 | Modulating the microstructure of metallic interconnect structures | Roger A. Quon, Chih-Chao Yang | 2020-01-07 |
| 10515903 | Selective CVD alignment-mark topography assist for non-volatile memory | Chih-Chao Yang, Lawrence A. Clevenger, Benjamin D. Briggs | 2019-12-24 |
| 10515894 | Enhanced self-alignment of vias for a semiconductor device | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Nicole Saulnier | 2019-12-24 |
| 10492019 | Binaural audio calibration | Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christopher J. Penny, Aldis Sipolins | 2019-11-26 |
| 10461248 | Bottom electrode for MRAM applications | Prasad Bhosale, Raghuveer R. Patlolla, Chih-Chao Yang | 2019-10-29 |
| 10446496 | Self-forming barrier for cobalt interconnects | Benjamin D. Briggs, Lawrence A. Clevenger, Takeshi Nogami | 2019-10-15 |
| 10431544 | Self-forming barrier for cobalt interconnects | Benjamin D. Briggs, Lawrence A. Clevenger, Takeshi Nogami | 2019-10-01 |
| 10431116 | Orator effectiveness through real-time feedback system with automatic detection of human behavioral and emotional states of orator and audience | Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha | 2019-10-01 |
| 10424456 | Fold over emitter and collector field emission transistor | Benjamin D. Briggs, Lawrence A. Clevenger | 2019-09-24 |
| 10404306 | Paint on micro chip touch screens | Maryam Ashoori, Benjamin D. Briggs, Justin A. Canaperi, Lawrence A. Clevenger, Leigh Anne H. Clevenger +1 more | 2019-09-03 |
| 10395986 | Fully aligned via employing selective metal deposition | Benjamin D. Briggs, James J. Kelly, Donald F. Canaperi, Lawrence A. Clevenger | 2019-08-27 |
| 10395977 | Self aligned via and pillar cut for at least a self aligned double pitch | Benjamin D. Briggs, Lawrence A. Clevenger, Terry A. Spooner, Theodorus E. Standaert | 2019-08-27 |