Issued Patents All Time
Showing 126–150 of 201 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10388525 | Multi-angled deposition and masking for custom spacer trim and selected spacer removal | Marc A. Bergendahl, Sean D. Burns, Lawrence A. Clevenger, Christopher J. Penny | 2019-08-20 |
| 10381563 | Resistive memory crossbar array compatible with Cu metallization | Takashi Ando, Lawrence A. Clevenger, Shyng-Tsong Chen | 2019-08-13 |
| 10366952 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny | 2019-07-30 |
| 10366920 | Location-specific laser annealing to improve interconnect microstructure | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo | 2019-07-30 |
| 10361157 | Method of manufacturing self-aligned interconnects by deposition of a non-conformal air-gap forming layer having an undulated upper surface | Benjamin D. Briggs, Lawrence A. Clevenger, Christopher J. Penny | 2019-07-23 |
| 10361079 | Multi-angled deposition and masking for custom spacer trim and selected spacer removal | Marc A. Bergendahl, Sean D. Burns, Lawrence A. Clevenger, Christopher J. Penny | 2019-07-23 |
| 10361117 | Selective ILD deposition for fully aligned via with airgap | Christopher J. Penny, Benjamin D. Briggs, Huai Huang, Lawrence A. Clevenger, Hosadurga Shobha | 2019-07-23 |
| 10361364 | Co-fabrication of magnetic device structures with electrical interconnects having reduced resistance through increased conductor grain size | Lawrence A. Clevenger, Liying Jiang, Sebastian Naczas, Chih-Chao Yang | 2019-07-23 |
| 10347825 | Selective deposition and nitridization of bottom electrode metal for MRAM applications | Benjamin D. Briggs, Joe Lee, Christopher J. Penny, Chih-Chao Yang | 2019-07-09 |
| 10319783 | Integrated magnetic tunnel junction (MTJ) in back end of line (BEOL) interconnects | Benjamin D. Briggs, Theodorus E. Standaert | 2019-06-11 |
| 10315451 | Structure, system, method, and recording medium of implementing a directed self-assembled security pattern | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo | 2019-06-11 |
| 10312434 | Selective deposition and nitridization of bottom electrode metal for MRAM applications | Benjamin D. Briggs, Joe Lee, Christopher J. Penny, Chih-Chao Yang | 2019-06-04 |
| 10303829 | Automated method for integrated analysis of back end of the line yield, line resistance/capacitance and process performance | Prasad Bhosale, Chih-Chao Yang | 2019-05-28 |
| 10297750 | Wraparound top electrode line for crossbar array resistive switching device | Takashi Ando, Benjamin D. Briggs, Lawrence A. Clevenger, Chih-Chao Yang | 2019-05-21 |
| 10290541 | Barrier layers in trenches and vias | Benjamin D. Briggs, Lawrence A. Clevenger, Cornelius Brown Peethala, Chih-Chao Yang | 2019-05-14 |
| 10276053 | Cognitive system to improve athletic performance with motivation from different training styles | Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha | 2019-04-30 |
| 10256191 | Hybrid dielectric scheme for varying liner thickness and manganese concentration | Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Takeshi Nogami, Christopher J. Penny | 2019-04-09 |
| 10249532 | Modulating the microstructure of metallic interconnect structures | Roger A. Quon, Chih-Chao Yang | 2019-04-02 |
| 10243020 | Structures and methods for embedded magnetic random access memory (MRAM) fabrication | Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Theodorus E. Standaert | 2019-03-26 |
| 10229967 | High-density MIM capacitors | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny | 2019-03-12 |
| 10211155 | Reducing metallic interconnect resistivity through application of mechanical strain | Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Theodorus E. Standaert | 2019-02-19 |
| 10211151 | Enhanced self-alignment of vias for asemiconductor device | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Nicole Saulnier | 2019-02-19 |
| 10204828 | Enabling low resistance gates and contacts integrated with bilayer dielectrics | Ruqiang Bao, Benjamin D. Briggs, Lawrence A. Clevenger, Koichi Motoyama, Cornelius Brown Peethala +1 more | 2019-02-12 |
| 10195901 | Smartwatch blackbox | Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha | 2019-02-05 |
| 10192829 | Low-temperature diffusion doping of copper interconnects independent of seed layer composition | Benjamin D. Briggs, Lawrence A. Clevenger, Chao-Kun Hu, Takeshi Nogami, Deepika Priyadarshini | 2019-01-29 |