Issued Patents All Time
Showing 176–200 of 201 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9899256 | Self-aligned airgaps with conductive lines and vias | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny | 2018-02-20 |
| 9899338 | Structure and fabrication method for enhanced mechanical strength crack stop | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny | 2018-02-20 |
| 9881431 | Security key system | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo | 2018-01-30 |
| 9858388 | Health monitoring using parallel cognitive processing | Maryam Ashoori, Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Jonathan H. Connell, II +1 more | 2018-01-02 |
| 9837305 | Forming deep airgaps without flop over | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny | 2017-12-05 |
| 9837485 | High-density MIM capacitors | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny | 2017-12-05 |
| 9837355 | Method for maximizing air gap in back end of the line interconnect through via landing modification | Benjamin D. Briggs, Lawrence A. Clevenger, Christopher J. Penny | 2017-12-05 |
| 9824982 | Structure and fabrication method for enhanced mechanical strength crack stop | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny | 2017-11-21 |
| 9793206 | Heterogeneous metallization using solid diffusion removal of metal interconnects | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny | 2017-10-17 |
| 9778007 | Matching a spent firearm cartridge | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo | 2017-10-03 |
| 9780035 | Structure and method for improved stabilization of cobalt cap and/or cobalt liner in interconnects | Benjamin D. Briggs, James J. Kelly, Koichi Motoyama, Roger A. Quon, Theodorus E. Standaert | 2017-10-03 |
| 9760817 | Security key system | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo | 2017-09-12 |
| 9758095 | Smartwatch blackbox | Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha | 2017-09-12 |
| 9754885 | Hybrid metal interconnects with a bamboo grain microstructure | Benjamin D. Briggs, Lawrence A. Clevenger, Chih-Chao Yang | 2017-09-05 |
| 9754883 | Hybrid metal interconnects with a bamboo grain microstructure | Benjamin D. Briggs, Lawrence A. Clevenger, Chih-Chao Yang | 2017-09-05 |
| 9754891 | Low-temperature diffusion doping of copper interconnects independent of seed layer composition | Benjamin D. Briggs, Lawrence A. Clevenger, Chao-Kun Hu, Takeshi Nogami, Deepika Priyadarshini | 2017-09-05 |
| 9685366 | Forming chamferless vias using thermally decomposable porefiller | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny | 2017-06-20 |
| 9666474 | Uniform dielectric recess depth during fin reveal | Benjamin D. Briggs, Lawrence A. Clevenger, Jay William Strane | 2017-05-30 |
| 9583498 | Structure and method for BEOL nanoscale damascene sidewall-defined non-volatile memory element | Benjamin D. Briggs, Lawrence A. Clevenger | 2017-02-28 |
| 9559107 | Structure and method for BEOL nanoscale damascene sidewall-defined non-volatile memory element | Benjamin D. Briggs, Lawrence A. Clevenger | 2017-01-31 |
| 9553019 | Airgap protection layer for via alignment | Benjamin D. Briggs, Lawrence A. Clevenger, Christopher J. Penny | 2017-01-24 |
| 9548243 | Self aligned via and pillar cut for at least a self aligned double pitch | Benjamin D. Briggs, Lawrence A. Clevenger, Terry A. Spooner, Theodorus E. Standaert | 2017-01-17 |
| 9431205 | Fold over emitter and collector field emission transistor | Benjamin D. Briggs, Lawrence A. Clevenger | 2016-08-30 |
| 9418327 | Security key system | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo | 2016-08-16 |
| 9418934 | Structure and fabrication method for electromigration immortal nanoscale interconnects | Benjamin D. Briggs, Lawrence A. Clevenger, Koichi Motoyama | 2016-08-16 |