Issued Patents All Time
Showing 76–100 of 201 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784156 | Self-aligned airgaps with conductive lines and vias | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny | 2020-09-22 |
| 10784197 | Method and structure to construct cylindrical interconnects to reduce resistance | Benjamin D. Briggs, Christopher J. Penny, Huai Huang, Lawrence A. Clevenger, Hosadurga Shobha | 2020-09-22 |
| 10785590 | Binaural audio calibration | Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christopher J. Penny, Aldis Sipolins | 2020-09-22 |
| 10770348 | Location-specific laser annealing to improve interconnect microstructure | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo | 2020-09-08 |
| 10770511 | Structures and methods for embedded magnetic random access memory (MRAM) fabrication | Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Theodorus E. Standaert | 2020-09-08 |
| 10770653 | Selective dielectric deposition to prevent gouging in MRAM | Christopher J. Penny, Marc A. Bergendahl, Christopher J. Waskiewicz | 2020-09-08 |
| 10763160 | Semiconductor device with selective insulator for improved capacitance | Christopher J. Penny, Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Hosadurga Shobha | 2020-09-01 |
| 10756260 | Co-fabrication of magnetic device structures with electrical interconnects having reduced resistance through increased conductor grain size | Lawrence A. Clevenger, Liying Jiang, Sebastian Naczas, Chih-Chao Yang | 2020-08-25 |
| 10752039 | Structure of implementing a directed self-assembled security pattern | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo | 2020-08-25 |
| 10747850 | Medication scheduling and alerts | Maryam Ashoori, Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Jonathan H. Connell, II +1 more | 2020-08-18 |
| 10746782 | Accelerated wafer testing using non-destructive and localized stress | Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Theodorus E. Standaert, James H. Stathis | 2020-08-18 |
| 10741609 | Pre-patterned etch stop for interconnect trench formation overlying embedded MRAM structures | Gangadhara Raja Muthinti, Oscar van der Straten, Chih-Chao Yang | 2020-08-11 |
| 10739397 | Accelerated wafer testing using non-destructive and localized stress | Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Theodorus E. Standaert, James H. Stathis | 2020-08-11 |
| 10720567 | Prevention of switching of spins in magnetic tunnel junctions by on-chip parasitic magnetic shield | Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Theodorus E. Standaert | 2020-07-21 |
| 10714683 | Multilayer hardmask for high performance MRAM devices | Daniel C. Edelstein, Theodorus E. Standaert, Kisup Chung, Isabel Cristina Chu, John C. Arnold | 2020-07-14 |
| 10714681 | Embedded magnetic tunnel junction pillar having reduced height and uniform contact area | Theodorus E. Standaert, Cornelius Brown Peethala | 2020-07-14 |
| 10707413 | Formation of embedded magnetic random-access memory devices | Ashim Dutta, Chih-Chao Yang, John C. Arnold, Jon Slaughter | 2020-07-07 |
| 10692925 | Dielectric fill for memory pillar elements | Theodorus E. Standaert, Isabel Cristina Chu, Chih-Chao Yang, Son V. Nguyen | 2020-06-23 |
| 10680169 | Multilayer hardmask for high performance MRAM devices | Daniel C. Edelstein, Theodorus E. Standaert, Kisup Chung, Isabel Cristina Chu, John C. Arnold | 2020-06-09 |
| 10679934 | Capacitance reduction in sea of lines BEOL metallization | Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Hosadurga Shobha | 2020-06-09 |
| 10672984 | Resistive memory crossbar array compatible with Cu metallization | Takashi Ando, Lawrence A. Clevenger, Shyng-Tsong Chen | 2020-06-02 |
| 10672611 | Hardmask stress, grain, and structure engineering for advanced memory applications | Ashim Dutta, Oscar van der Straten, Chih-Chao Yang | 2020-06-02 |
| 10658589 | Alignment through topography on intermediate component for memory device patterning | Hao Tang, Injo Ok, Theodorus E. Standaert | 2020-05-19 |
| 10651078 | Selective ILD deposition for fully aligned via with airgap | Christopher J. Penny, Benjamin D. Briggs, Huai Huang, Lawrence A. Clevenger, Hosadurga Shobha | 2020-05-12 |
| 10629529 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny | 2020-04-21 |