| 10763160 |
Semiconductor device with selective insulator for improved capacitance |
Christopher J. Penny, Benjamin D. Briggs, Michael Rizzolo, Lawrence A. Clevenger, Hosadurga Shobha |
2020-09-01 |
| 10679934 |
Capacitance reduction in sea of lines BEOL metallization |
Benjamin D. Briggs, Lawrence A. Clevenger, Christopher J. Penny, Michael Rizzolo, Hosadurga Shobha |
2020-06-09 |
| 10651078 |
Selective ILD deposition for fully aligned via with airgap |
Christopher J. Penny, Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo, Hosadurga Shobha |
2020-05-12 |
| 10629478 |
Dual-damascene formation with dielectric spacer and thin liner |
Benjamin D. Briggs, Lawrence A. Clevenger, Christopher J. Penny, Michael Rizzolo, Hosadurga Shobha |
2020-04-21 |
| 10629529 |
Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo |
2020-04-21 |
| 10529662 |
Method and structure to construct cylindrical interconnects to reduce resistance |
Benjamin D. Briggs, Michael Rizzolo, Christopher J. Penny, Lawrence A. Clevenger, Hosadurga Shobha |
2020-01-07 |
| 10366952 |
Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo |
2019-07-30 |
| 10361117 |
Selective ILD deposition for fully aligned via with airgap |
Christopher J. Penny, Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo, Hosadurga Shobha |
2019-07-23 |
| 10229967 |
High-density MIM capacitors |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo |
2019-03-12 |
| 10217664 |
Reflow interconnect using Ru |
Lawrence A. Clevenger, Su Chen Fan, Koichi Motoyama, Wei Wang, Chih-Chao Yang |
2019-02-26 |
| 10211101 |
Reflow interconnect using Ru |
Lawrence A. Clevenger, Su Chen Fan, Koichi Motoyama, Wei Wang, Chih-Chao Yang |
2019-02-19 |
| 10109579 |
Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo |
2018-10-23 |
| 10083905 |
Skip-vias bypassing a metallization level at minimum pitch |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo |
2018-09-25 |
| 9997451 |
Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo |
2018-06-12 |
| 9966337 |
Fully aligned via with integrated air gaps |
Benjamin D. Briggs, Lawrence A. Clevenger, Christopher J. Penny, Michael Rizzolo, Hosadurga Shobha |
2018-05-08 |
| 9960078 |
Reflow interconnect using Ru |
Lawrence A. Clevenger, Su Chen Fan, Koichi Motoyama, Wei Wang, Chih-Chao Yang |
2018-05-01 |
| 9911651 |
Skip-vias bypassing a metallization level at minimum pitch |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo |
2018-03-06 |
| 9899256 |
Self-aligned airgaps with conductive lines and vias |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo |
2018-02-20 |
| 9899338 |
Structure and fabrication method for enhanced mechanical strength crack stop |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo |
2018-02-20 |
| 9837485 |
High-density MIM capacitors |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo |
2017-12-05 |
| 9837305 |
Forming deep airgaps without flop over |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo |
2017-12-05 |
| 9824982 |
Structure and fabrication method for enhanced mechanical strength crack stop |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo |
2017-11-21 |
| 9793206 |
Heterogeneous metallization using solid diffusion removal of metal interconnects |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo |
2017-10-17 |
| 9685366 |
Forming chamferless vias using thermally decomposable porefiller |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo |
2017-06-20 |
