Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Interconnect with self-forming wrap-all-around barrier layer

Interconnect with self-forming wrap-all-around barrier layer

US Patent 10978342 · Granted Apr 13, 2021

Estimated economic value: $3,936,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Convertible stem/fracture stem2025
Reduced capacitance between power via bar and gates2025
Backside self aligned skip via2025
Airgap spacer for power via2025
Self-forming barrier for use in air gap formation2025
Early backside first power delivery network2025
Source/drain contact at tight cell boundary2025
BEOL interconnect subtractive etch super via2025
BEOL interconnect subtractive etch super via2025
Backside power rail with tight space2025
Interconnect structures with vias having vertical and horizontal sections2025
Wrap around metal via structure2025