Issued Patents All Time
Showing 51–75 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10204856 | Interconnect structures with fully aligned vias | Nicholas C. M. Fuller, Elbert E. Huang, Satyanarayana V. Nitta, David L. Rath | 2019-02-12 |
| 10177092 | Formation of advanced interconnects | Chih-Chao Yang | 2019-01-08 |
| 10177089 | Advanced E-fuse structure with controlled microstructure | Chih-Chao Yang | 2019-01-08 |
| 10170424 | Cobalt first layer advanced metallization for interconnects | Chih-Chao Yang | 2019-01-01 |
| 10163793 | Cobalt first layer advanced metallization for interconnects | Chih-Chao Yang | 2018-12-25 |
| 10134675 | Cobalt top layer advanced metallization for interconnects | Chih-Chao Yang | 2018-11-20 |
| 10128186 | Simultaneous formation of liner and metal conductor | Chih-Chao Yang | 2018-11-13 |
| 10121740 | Advanced e-Fuse structure with hybrid metal controlled microstructure | Chih-Chao Yang | 2018-11-06 |
| 10115670 | Formation of advanced interconnects including set of metal conductor structures in patterned dielectric layer | Chih-Chao Yang | 2018-10-30 |
| 10109585 | Formation of advanced interconnects including a set of metal conductor structures in a patterned dielectric layer | Chih-Chao Yang | 2018-10-23 |
| 10109675 | Forming self-aligned contacts on pillar structures | Anthony J. Annunziata, Eugene J. O'Sullivan, Henry K. Utomo | 2018-10-23 |
| 10032716 | Advanced E-fuse structure with controlled microstructure | Chih-Chao Yang | 2018-07-24 |
| 10020358 | Metal resistors having nitridized dielectric surface layers and nitridized metal surface layers | Chih-Chao Yang | 2018-07-10 |
| 10008446 | Advanced E-fuse structure with enhanced electromigration fuse element | Chih-Chao Yang | 2018-06-26 |
| 9997460 | Formation of advanced interconnects | Chih-Chao Yang | 2018-06-12 |
| 9991330 | Resistors with controlled resistivity | Chih-Chao Yang | 2018-06-05 |
| 9985088 | Metal resistors having nitridized metal surface layers with different nitrogen content | Chih-Chao Yang | 2018-05-29 |
| 9972672 | Tunable resistor with curved resistor elements | Chih-Chao Yang | 2018-05-15 |
| 9972671 | Metal resistors having varying resistivity | Chih-Chao Yang | 2018-05-15 |
| 9953950 | Nitride-enriched oxide-to-oxide 3D wafer bonding | Chih-Chao Yang | 2018-04-24 |
| 9947579 | Copper interconnect structure with manganese oxide barrier layer | Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha | 2018-04-17 |
| 9947655 | 3D bonded semiconductor structure with an embedded capacitor | Chih-Chao Yang | 2018-04-17 |
| 9947622 | Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects | Donald F. Canaperi, Alfred Grill, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini +1 more | 2018-04-17 |
| 9947581 | Method of forming a copper based interconnect structure | Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha | 2018-04-17 |
| 9941241 | Method for wafer-wafer bonding | Chih-Chao Yang | 2018-04-10 |