Issued Patents All Time
Showing 101–125 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691705 | Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects | Donald F. Canaperi, Alfred Grill, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini +1 more | 2017-06-27 |
| 9691656 | Self-forming embedded diffusion barriers | Cyril Cabral, Jr., Juntao Li, Takeshi Nogami | 2017-06-27 |
| 9659817 | Structure and process for W contacts | Baozhen Li, Chih-Chao Yang | 2017-05-23 |
| 9653567 | Lateral bipolar transistor | Fabio Carta, Stephen M. Gates, Bahman Hekmatshoartabari, Tak H. Ning | 2017-05-16 |
| 9653403 | Structure and process for W contacts | Baozhen Li, Chih-Chao Yang | 2017-05-16 |
| 9646931 | Formation of liner and metal conductor | Chih-Chao Yang | 2017-05-09 |
| 9620481 | Substrate bonding with diffusion barrier structures | Douglas C. La Tulipe, Jr., Wei Lin, Deepika Priyadarshini, Spyridon Skordas, Tuan A. Vo +1 more | 2017-04-11 |
| 9620479 | 3D bonded semiconductor structure with an embedded resistor | Chih-Chao Yang | 2017-04-11 |
| 9601432 | Advanced metallization for damage repair | Chih-Chao Yang | 2017-03-21 |
| 9601371 | Interconnect structure with barrier layer | Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha | 2017-03-21 |
| 9589894 | Copper interconnect structure and its formation | Takeshi Nogami, Christopher C. Parks, Tsong-Lin Tai | 2017-03-07 |
| 9583410 | Volumetric integrated circuit and volumetric integrated circuit manufacturing method | Michael A. Gaynes, Thomas M. Shaw, Bucknell C. Webb, Roy R. Yu | 2017-02-28 |
| 9536780 | Method and apparatus for single chamber treatment | Chih-Chao Yang | 2017-01-03 |
| 9508647 | Single damascene interconnect structure | Shyng-Tsong Chen, Takeshi Nogami | 2016-11-29 |
| 9496239 | Nitride-enriched oxide-to-oxide 3D wafer bonding | Chih-Chao Yang | 2016-11-15 |
| 9472503 | Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects | Donald F. Canaperi, Alfred Grill, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini +1 more | 2016-10-18 |
| 9455182 | Interconnect structure with capping layer and barrier layer | Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha | 2016-09-27 |
| 9425298 | Lateral bipolar transistor | Fabio Carta, Stephen M. Gates, Bahman Hekmatshoartabari, Tak H. Ning | 2016-08-23 |
| 9406617 | Structure and process for W contacts | Baozhen Li, Chih-Chao Yang | 2016-08-02 |
| 9332628 | Microelectronic structure including air gap | David V. Horak, Elbert E. Huang, Satyanarayana V. Nitta, Takeshi Nogami, Shom Ponoth +1 more | 2016-05-03 |
| 9324650 | Interconnect structures with fully aligned vias | Nicholas C. M. Fuller, Elbert E. Huang, Satyanarayana V. Nitta, David L. Rath | 2016-04-26 |
| 9318415 | Beol structures incorporating active devices and mechanical strength | Stephen M. Gates, Satyanarayana V. Nitta | 2016-04-19 |
| 9299765 | Altering capacitance of MIM capacitor having reactive layer therein | Anthony K. Stamper | 2016-03-29 |
| 9275952 | Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects | Donald F. Canaperi, Alfred Grill, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini +1 more | 2016-03-01 |
| 9275936 | BEOL structures incorporating active devices and mechanical strength | Stephen M. Gates, Satyanarayana V. Nitta | 2016-03-01 |