Issued Patents All Time
Showing 151–175 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8669182 | Metal cap with ultra-low κ dielectric material for circuit interconnect applications | Chih-Chao Yang | 2014-03-11 |
| 8658533 | Semiconductor interconnect structure with multi-layered seed layer providing enhanced reliability and minimizing electromigration | Takeshi Nogami | 2014-02-25 |
| 8648465 | Semiconductor interconnect structure having enhanced performance and reliability | Cyril Cabral, Jr., Geraud Jean-Michel Dubois, Takeshi Nogami, Daniel P. Sanders | 2014-02-11 |
| 8624323 | BEOL structures incorporating active devices and mechanical strength | Stephen M. Gates, Satyanarayana V. Nitta | 2014-01-07 |
| 8617984 | Tungsten metallization: structure and fabrication of same | Chih-Chao Yang | 2013-12-31 |
| 8610276 | Metal cap for back end of line (BEOL) interconnects, design structure and method of manufacture | Chih-Chao Yang, Kaushik Chanda | 2013-12-17 |
| 8563419 | Method of manufacturing an interconnect structure and design structure thereof | Chih-Chao Yang, Kaushik Chanda | 2013-10-22 |
| 8564132 | Tungsten metallization: structure and fabrication of same | Chih-Chao Yang | 2013-10-22 |
| 8530320 | High-nitrogen content metal resistor and method of forming same | Chih-Chao Yang | 2013-09-10 |
| 8525169 | Reliable physical unclonable function for device authentication | Stephen M. Gates, Edward W. Kiewra, Satyanarayana V. Nitta, Ramachandran Muralidhar, Dirk Pfeiffer | 2013-09-03 |
| 8513769 | Electrical fuses and resistors having sublithographic dimensions | Charles T. Black, Matthew E. Colburn, Timothy J. Dalton, Wai-Kin Li, Anthony K. Stamper +1 more | 2013-08-20 |
| 8497202 | Interconnect structures and methods of manufacturing of interconnect structures | Takeshi Nogami | 2013-07-30 |
| 8497580 | Noble metal cap for interconnect structures | Chih-Chao Yang, Fenton R. McFeely | 2013-07-30 |
| 8492289 | Barrier layer formation for metal interconnects through enhanced impurity diffusion | Takeshi Nogami, Hosadurga Shobha | 2013-07-23 |
| 8481423 | Methods to mitigate plasma damage in organosilicate dielectrics | John C. Arnold, Griselda Bonilla, William J. Cote, Geraud Jean-Michel Dubois, Alfred Grill +8 more | 2013-07-09 |
| 8470706 | Methods to mitigate plasma damage in organosilicate dielectrics | John C. Arnold, Griselda Bonilla, William J. Cote, Geraud Jean-Michel Dubois, Alfred Grill +8 more | 2013-06-25 |
| 8461678 | Structure with self aligned resist layer on an interconnect surface and method of making same | Elbert E. Huang, Robert D. Miller | 2013-06-11 |
| 8440522 | Increasing an electrical resistance of a resistor by oxidation | Arne Ballantine, Anthony K. Stamper | 2013-05-14 |
| 8420531 | Enhanced diffusion barrier for interconnect structures | Chih-Chao Yang, Steven E. Molis | 2013-04-16 |
| 8404145 | Method for forming an indium cap layer | Maurice McGlashan-Powell, Eugene J. O'Sullivan | 2013-03-26 |
| 8383507 | Method for fabricating air gap interconnect structures | Kaushik Chanda, Cathryn J. Christiansen, Satyanarayana V. Nitta, Son V. Nguyen, Shom Ponoth +1 more | 2013-02-26 |
| 8363379 | Altering capacitance of MIM capacitor having reactive layer therein | Anthony K. Stamper | 2013-01-29 |
| 8343868 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons, Jeffrey P. Gambino +10 more | 2013-01-01 |
| 8336204 | Formation of alloy liner by reaction of diffusion barrier and seed layer for interconnect application | Chih-Chao Yang, Takeshi Nogami | 2012-12-25 |
| 8293634 | Structures and methods for improving solder bump connections in semiconductor devices | Felix P. Anderson, William J. Cote, Thomas L. McDevitt, Anthony K. Stamper | 2012-10-23 |