DE

Daniel C. Edelstein

IBM: 293 patents #76 of 70,183Top 1%
TE Tessera: 8 patents #54 of 271Top 20%
Globalfoundries: 6 patents #578 of 4,424Top 15%
GU Globalfoundries U.S.: 2 patents #5 of 211Top 3%
CF Cornell Research Foundation: 2 patents #418 of 1,638Top 30%
Infineon Technologies Ag: 2 patents #3,160 of 7,486Top 45%
TC Toshiba America Electronic Components: 2 patents #14 of 77Top 20%
AM AMD: 2 patents #3,994 of 9,279Top 45%
FS Freeescale Semiconductor: 1 patents #2,021 of 3,767Top 55%
Applied Materials: 1 patents #4,780 of 7,310Top 70%
📍 White Plains, NY: #2 of 917 inventorsTop 1%
🗺 New York: #53 of 115,490 inventorsTop 1%
Overall (All Time): #1,168 of 4,157,543Top 1%
312
Patents All Time

Issued Patents All Time

Showing 176–200 of 312 patents

Patent #TitleCo-InventorsDate
8294270 Copper alloy via bottom liner Edward C. Cooney, III, John A. Fitzsimmons, Jeffrey P. Gambino, Anthony K. Stamper 2012-10-23
8288268 Microelectronic structure including air gap David V. Horak, Elbert E. Huang, Satyanarayana V. Nitta, Takeshi Nogami, Shom Ponoth +1 more 2012-10-16
8247904 Interconnection between sublithographic-pitched structures and lithographic-pitched structures Sarunya Bangsaruntip, William D. Hinsberg, Ho-Cheol Kim, Steven J. Koester, Paul M. Soloman 2012-08-21
8232645 Interconnect structures, design structure and method of manufacture Chih-Chao Yang, Kaushik Chanda 2012-07-31
8227336 Structure with self aligned resist layer on an interconnect surface and method of making same Elbert E. Huang, Robert D. Miller 2012-07-24
8138604 Metal cap with ultra-low k dielectric material for circuit interconnect applications Chih-Chao Yang 2012-03-20
8133810 Structure for metal cap applications Chih-Chao Yang, Keith Kwong Hon Wong, Haining Yang 2012-03-13
8129286 Reducing effective dielectric constant in semiconductor devices Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons, Jeffrey P. Gambino +10 more 2012-03-06
8120143 Integrated circuit comb capacitor Anil K. Chinthakindi, Timothy J. Dalton, Ebenezer E. Eshun, Jeffrey P. Gambino, Sarah L. Lane +1 more 2012-02-21
8120179 Air gap interconnect structures and methods for forming the same Kaushik Chanda, Cathryn J. Christiansen, Satyanarayana V. Nitta, Son V. Nguyen, Shom Ponoth +1 more 2012-02-21
8101236 Method of fabricating a SiCOH dielectric material with improved toughness and improved Si-C bonding Stephen M. Gates, Alfred Grill, Michael Lane, Qinghuang Lin, Robert D. Miller +2 more 2012-01-24
8003520 Air gap structure having protective metal silicide pads on a metal feature Griselda Bonilla, Satyanarayana V. Nitta, Takeshi Nogami, Shom Ponoth, David L. Rath +1 more 2011-08-23
7998864 Noble metal cap for interconnect structures Chih-Chao Yang, Fenton R. McFeely 2011-08-16
7993817 Structure with self aligned resist layer on an insulating surface and method of making same Elbert E. Huang, Robert D. Miller 2011-08-09
7977032 Method to create region specific exposure in a layer Christos D. Dimitrakopoulos, Vincent J. McGahay, Satyanarayana V. Nitta, Kevin S. Petrarca, Shom Ponoth +1 more 2011-07-12
7968949 Contact forming method and related semiconductor device Louis L. Hsu, Chih-Chao Yang 2011-06-28
7964966 Via gouged interconnect structure and method of fabricating same Chih-Chao Yang, Theodorus E. Standaert 2011-06-21
7956463 Large grain size conductive structure for narrow interconnect openings Chih-Chao Yang, Takeshi Nogami, Stephen M. Rossnagel 2011-06-07
7955971 Hybrid metallic wire and methods of fabricating same Chih-Chao Yang, Kaushik Chanda, Baozhen Li 2011-06-07
7951714 High aspect ratio electroplated metal feature and method Keith Kwong Hon Wong, Chih-Chao Yang, Haining Yang 2011-05-31
7951708 Copper interconnect structure with amorphous tantalum iridium diffusion barrier Patrick W. DeHaven, Philip L. Flaitz, Takeshi Nogami, Stephen M. Rossnagel, Chih-Chao Yang 2011-05-31
7943480 Sub-lithographic dimensioned air gap formation and related structure Nicholas C. M. Fuller, David V. Horak, Elbert E. Huang, Wai-Kin Li, Anthony D. Lisi +2 more 2011-05-17
7928569 Redundant barrier structure for interconnect and wiring applications, design structure and method of manufacture Chih-Chao Yang 2011-04-19
7892648 SiCOH dielectric material with improved toughness and improved Si-C bonding Stephen M. Gates, Alfred Grill, Michael Lane, Robert D. Miller, Deborah A. Neumayer +1 more 2011-02-22
7892940 Device and methodology for reducing effective dielectric constant in semiconductor devices Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons, Jeffrey P. Gambino +10 more 2011-02-22