Issued Patents All Time
Showing 226–250 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7456074 | Increasing an electrical resistance of a resistor by nitridization | Arne Ballantine, Anthony K. Stamper | 2008-11-25 |
| 7405147 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons, Jeffrey P. Gambino +10 more | 2008-07-29 |
| 7394110 | Planar vertical resistor and bond pad resistor | Douglas D. Coolbaugh, Timothy J. Dalton, Ebenezer E. Eshun, Jeffrey P. Gambino, Kevin S. Petrarca +2 more | 2008-07-01 |
| 7375021 | Method and structure for eliminating aluminum terminal pad material in semiconductor devices | Mukta G. Farooq, Robert Hannon, Ian D. Melville | 2008-05-20 |
| 7361993 | Terminal pad structures and methods of fabricating same | Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Robert M. Rassel, Anthony K. Stamper | 2008-04-22 |
| 7351639 | Increasing an electrical resistance of a resistor by oxidation or nitridization | Arne Ballantine, Anthony K. Stamper | 2008-04-01 |
| 7327033 | Copper alloy via bottom liner | Edward C. Cooney, III, John A. Fitzsimmons, Jeffrey P. Gambino, Anthony K. Stamper | 2008-02-05 |
| 7276787 | Silicon chip carrier with conductive through-vias and method for fabricating same | Paul S. Andry, Leena Paivikki Buchwalter, Jon A. Casey, Sherif A. Goma, Raymond R. Horton +9 more | 2007-10-02 |
| 7273770 | Compliant passivated edge seal for low-k interconnect structures | Lee M. Nicholson | 2007-09-25 |
| 7271699 | Changing an electrical resistance of a resistor | Arne Ballantine, Cyril Cabral, Jr., Anthony K. Stamper | 2007-09-18 |
| 7253100 | Reducing damage to ulk dielectric during cross-linked polymer removal | Ronald A. DellaGuardia, Habib Hichri, Vincent J. McGahay | 2007-08-07 |
| 7129561 | Tri-metal and dual-metal stacked inductors | Douglas D. Coolbaugh, Robert A. Groves, Zhong-Xiang He | 2006-10-31 |
| 7119018 | Copper conductor | Michael Lane, Stefanie Chiras, Terry A. Spooner, Robert Rosenberg | 2006-10-10 |
| 7115996 | Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped | Sung Kwon Kang, Maurice McGlashan-Powell, Eugene J. O'Sullivan, George F. Walker | 2006-10-03 |
| 7098544 | Edge seal for integrated circuit chips | Lee M. Nicholson | 2006-08-29 |
| 7084079 | Method for low temperature chemical vapor deposition of low-k films using selected cyclosiloxane and ozone gases for semiconductor applications | Richard A. Conti, Gill Yong Lee | 2006-08-01 |
| 7081680 | Self-aligned corrosion stop for copper C4 and wirebond | Anthony K. Stamper, Judith M. Rubino, Carlos J. Sambucetti | 2006-07-25 |
| 7068138 | High Q factor integrated circuit inductor | Panayotis Andricacos, John M. Cotte, Hariklia Deligianni, John Harold Magerlein, Kevin S. Petrarca +2 more | 2006-06-27 |
| 7067437 | Structures with improved interfacial strength of SiCOH dielectrics and method for preparing the same | Alfred Grill, Vishnubhai V. Patel, Darryl D. Restaino | 2006-06-27 |
| 7033927 | Apparatus and method for thermal isolation, circuit cooling and electromagnetic shielding of a wafer | Guy M. Cohen, Keith A. Jenkins, Chirag S. Patel, Lie Shan | 2006-04-25 |
| 7030031 | Method for forming damascene structure utilizing planarizing material coupled with diffusion barrier material | William C. Wille, William J. Cote, Peter Biolsi, John Fritche, Allan Upham | 2006-04-18 |
| 7015581 | Low-K dielectric material system for IC application | Jon A. Casey | 2006-03-21 |
| 6992390 | Liner with improved electromigration redundancy for damascene interconnects | Baozhen Li, Timothy D. Sullivan | 2006-01-31 |
| 6946716 | Electroplated interconnection structures on integrated circuit chips | Panayotis Andricacos, Harikilia Deligianni, John O. Dukovic, Wilma Jean Horkans, Chao-Kun Hu +4 more | 2005-09-20 |
| 6878616 | Low-k dielectric material system for IC application | Jon A. Casey | 2005-04-12 |