Issued Patents All Time
Showing 276–300 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6437440 | Thin film metal barrier for electrical interconnections | Cyril Cabral, Jr., Patrick W. DeHaven, David P. Klaus, James Manley Pollard, III, Carol L. Stanis +1 more | 2002-08-20 |
| 6413854 | Method to build multi level structure | Cyprian Emeka Uzoh, Cheryl G. Faltermeier, Peter S. Locke | 2002-07-02 |
| 6399496 | Copper interconnection structure incorporating a metal seed layer | James M. E. Harper, Chao-Kun Hu, Andrew H. Simon, Cyprian Emeka Uzoh | 2002-06-04 |
| 6375693 | Chemical-mechanical planarization of barriers or liners for copper metallurgy | William J. Cote, Naftali E. Lustig | 2002-04-23 |
| 6358832 | Method of forming barrier layers for damascene interconnects | Timothy J. Dalton, John G. Gaudiello, Mahadevaiyer Krishnan, Sandra G. Malhotra, Maurice McGlashan-Powell +2 more | 2002-03-19 |
| 6337151 | Graded composition diffusion barriers for chip wiring applications | Cyprian Emeka Uzoh, Andrew H. Simon | 2002-01-08 |
| 6335104 | Method for preparing a conductive pad for electrical connection and conductive pad formed | Carlos J. Sambucetti, John G. Gaudiello, Judith M. Rubino, George F. Walker | 2002-01-01 |
| 6323128 | Method for forming Co-W-P-Au films | Carlos J. Sambucetti, Judith M. Rubino, Cyryl Cabral, Jr., George F. Walker, John G. Gaudiello +1 more | 2001-11-27 |
| 6301903 | Apparatus for activating fusible links on a circuit substrate | Chandrasekhar Narayan | 2001-10-16 |
| 6297140 | Method to plate C4 to copper stud | Cyprian Emeka Uzoh | 2001-10-02 |
| 6291885 | Thin metal barrier for electrical interconnections | Cyril Cabral, Jr., Patrick W. DeHaven, David P. Klaus, James Manley Pollard, III, Carol L. Stanis +1 more | 2001-09-18 |
| 6281583 | Planar integrated circuit interconnect | Bachir Dirahoui, Robert C. Greenlese, Harris C. Jones | 2001-08-28 |
| 6270646 | Electroplating apparatus and method using a compressible contact | Erick G. Walton, Dean S. Chung, Lara Sandra Collins, William E. Corbin, Jr., Hariklia Deligianni +4 more | 2001-08-07 |
| 6252295 | Adhesion of silicon carbide films | Donna R. Cote, John A. Fitzsimmons, Thomas Ivers, Paul C. Jamison, Ernest N. Levine | 2001-06-26 |
| 6251787 | Elimination of photo-induced electrochemical dissolution in chemical mechanical polishing | Wilma Jean Horkans, Stephen E. Luce, Naftall E. Lustig, Keith R. Pope, Peter D. Roper | 2001-06-26 |
| 6251528 | Method to plate C4 to copper stud | Cyprian Emeka Uzoh | 2001-06-26 |
| 6234870 | Serial intelligent electro-chemical-mechanical wafer processor | Cyprian Emeka Uzoh | 2001-05-22 |
| 6181012 | Copper interconnection structure incorporating a metal seed layer | James M. E. Harper, Chao-Kun Hu, Andrew H. Simon, Cyprian Emeka Uzoh | 2001-01-30 |
| 6153935 | Dual etch stop/diffusion barrier for damascene interconnects | Timothy J. Dalton, John G. Gaudiello, Mahadevaiyer Krishnan, Sandra G. Malhotra, Maurice McGlashan-Powell +2 more | 2000-11-28 |
| 6153043 | Elimination of photo-induced electrochemical dissolution in chemical mechanical polishing | Wilma Jean Horkans, Stephen E. Luce, Naftali E. Lustig, Keith R. Pope, Peter D. Roper | 2000-11-28 |
| 6133136 | Robust interconnect structure | Vincent J. McGahay, Henry A. Nye, III, Brian George Reid Ottey, William H. Price | 2000-10-17 |
| 6114937 | Integrated circuit spiral inductor | Joachim Norbert Burghartz, Christopher V. Jahnes, Cyprian Emeka Uzoh | 2000-09-05 |
| 6106687 | Process and diffusion baffle to modulate the cross sectional distribution of flow rate and deposition rate | — | 2000-08-22 |
| 6103096 | Apparatus and method for the electrochemical etching of a wafer | Madhav Datta, Cyprian Emeka Uzoh | 2000-08-15 |
| 6091273 | Voltage limiting circuit for fuse technology | Kerry Bernstein, William A. Klaasen, Wilbur D. Pricer | 2000-07-18 |