Issued Patents All Time
Showing 251–275 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6862799 | Method for changing an electrical resistance of a resistor | Arne Ballantine, Cyril Cabral, Jr., Anthony K. Stamper | 2005-03-08 |
| 6784088 | Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped | Sung Kwon Kang, Maurice McGlashan-Powell, Eugene J. O'Sullivan, George F. Walker | 2004-08-31 |
| 6779711 | Self-aligned corrosion stop for copper C4 and wirebond | Anthony K. Stamper, Judith M. Rubino, Carlos J. Sambucetti | 2004-08-24 |
| 6777809 | BEOL decoupling capacitor | Peter Richard Duncombe, Robert Benjamin Laibowitz, Deborah A. Neumayer, Tak H. Ning, Robert Rosenberg +1 more | 2004-08-17 |
| 6746947 | Post-fuse blow corrosion prevention structure for copper fuses | Timothy H. Daubenspeck, Robert M. Geffken, William T. Motsiff, Anthony K. Stamper, Steven H. Voldman | 2004-06-08 |
| 6743268 | Chemical-mechanical planarization of barriers or liners for copper metallurgy | William J. Cote, Naftali E. Lustig | 2004-06-01 |
| 6740539 | Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates | Richard A. Conti, Prakash Dev, David M. Dobuzinsky, Gill Yong Lee, Kia-Seng Low +3 more | 2004-05-25 |
| 6730984 | Increasing an electrical resistance of a resistor by oxidation or nitridization | Arne Ballantine, Anthony K. Stamper | 2004-05-04 |
| 6709562 | Method of making electroplated interconnection structures on integrated circuit chips | Panayotis Andricacos, Hariklia Deligianni, John O. Dukovic, Wilma Jean Horkans, Chao-Kun Hu +4 more | 2004-03-23 |
| 6647614 | Method for changing an electrical resistance of a resistor | Arne Ballantine, Cyril Cabral, Jr., Anthony K. Stamper | 2003-11-18 |
| 6649531 | Process for forming a damascene structure | William J. Cote, Timothy J. Dalton, Prakash Dev, Scott D. Halle, Gill Yong Lee +1 more | 2003-11-18 |
| 6646345 | Method for forming Co-W-P-Au films | Carlos J. Sambucetti, Judith M. Rubino, Cyryl Cabral, Jr., George F. Walker, John G. Gaudiello +1 more | 2003-11-11 |
| 6632377 | Chemical-mechanical planarization of metallurgy | Vlasta Brusic, Paul M. Feeney, William L. Guthrie, Mark A. Jaso, Frank B. Kaufman +4 more | 2003-10-14 |
| 6570256 | Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates | Richard A. Conti, Prakash Dev, David M. Dobuzinsky, Gill Yong Lee, Kia-Seng Low +3 more | 2003-05-27 |
| 6569783 | Graded composition diffusion barriers for chip wiring applications | Cyprian Emeka Uzoh, Andrew H. Simon | 2003-05-27 |
| 6551931 | Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped | Sung Kwon Kang, Maurice McGlashan-Powell, Eugene J. O'Sullivan, George F. Walker | 2003-04-22 |
| 6548901 | Cu/low-k BEOL with nonconcurrent hybrid dielectric interface | William J. Cote, Timothy J. Dalton, Stephen M. Gates | 2003-04-15 |
| 6531412 | Method for low temperature chemical vapor deposition of low-k films using selected cyclosiloxane and ozone gases for semiconductor applications | Richard A. Conti, Gill Yong Lee | 2003-03-11 |
| 6525427 | BEOL decoupling capacitor | Peter Richard Duncombe, Robert Benjamin Laibowitz, Deborah A. Neumayer, Tak H. Ning, Robert Rosenberg +1 more | 2003-02-25 |
| 6522304 | Dual damascene horn antenna | Arne Ballantine, James S. Nakos, Anthony K. Stamper | 2003-02-18 |
| 6498385 | Post-fuse blow corrosion prevention structure for copper fuses | Timothy H. Daubenspeck, Robert M. Geffken, William T. Motsiff, Anthony K. Stamper, Steven H. Voldman | 2002-12-24 |
| 6492259 | Process for making a planar integrated circuit interconnect | Bachir Dirahoui, Robert C. Greenlese, Harris C. Jones | 2002-12-10 |
| 6486557 | Hybrid dielectric structure for improving the stiffness of back end of the line structures | Charles R. Davis, John C. Hay, Jr., Jeffrey Hedrick, Christopher V. Jahnes, Vincent J. McGahay +1 more | 2002-11-26 |
| 6465376 | Method and structure for improving electromigration of chip interconnects | Cyprian Emeka Uzoh, Andrew H. Simon | 2002-10-15 |
| 6457234 | Process for manufacturing self-aligned corrosion stop for copper C4 and wirebond | Judith M. Rubino, Carlos J. Sambucetti, Anthony K. Stamper | 2002-10-01 |