DE

Daniel C. Edelstein

IBM: 293 patents #76 of 70,183Top 1%
TE Tessera: 8 patents #54 of 271Top 20%
Globalfoundries: 6 patents #578 of 4,424Top 15%
GU Globalfoundries U.S.: 2 patents #5 of 211Top 3%
CF Cornell Research Foundation: 2 patents #418 of 1,638Top 30%
Infineon Technologies Ag: 2 patents #3,160 of 7,486Top 45%
TC Toshiba America Electronic Components: 2 patents #14 of 77Top 20%
AM AMD: 2 patents #3,994 of 9,279Top 45%
FS Freeescale Semiconductor: 1 patents #2,021 of 3,767Top 55%
Applied Materials: 1 patents #4,780 of 7,310Top 70%
📍 White Plains, NY: #2 of 917 inventorsTop 1%
🗺 New York: #53 of 115,490 inventorsTop 1%
Overall (All Time): #1,168 of 4,157,543Top 1%
312
Patents All Time

Issued Patents All Time

Showing 201–225 of 312 patents

Patent #TitleCo-InventorsDate
7888741 Structures with improved interfacial strength of SiCOH dielectrics and method for preparing the same Alfred Grill, Vishnubhai V. Patel, Darryl D. Restaino 2011-02-15
7884477 Air gap structure having protective metal silicide pads on a metal feature Griselda Bonilla, Satyanarayana V. Nitta, Takeshi Nogami, Shom Ponoth, David L. Rath +1 more 2011-02-08
7863150 Method to generate airgaps with a template first scheme and a self aligned blockout mask Matthew E. Colburn, Satya V. Nitta, Sampath Purushothaman, Shom Ponth 2011-01-04
7859113 Structure including via having refractory metal collar at copper wire and dielectric layer liner-less interface and related method Takeshi Nogami, Ping-Chuan Wang, Yun-Yu Wang, Chih-Chao Yang 2010-12-28
7829427 Method of fabricating a high Q factor integrated circuit inductor Panayotis Andricacos, John M. Cotte, Hariklia Deligianni, John Harold Magerlein, Kevin S. Petrarca +2 more 2010-11-09
7829452 Terminal pad structures and methods of fabricating same Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Robert M. Rassel, Anthony K. Stamper 2010-11-09
7804391 Changing an electrical resistance of a resistor Arne Ballantine, Cyril Cabral, Jr., Anthony K. Stamper 2010-09-28
7795155 Method for forming an indium cap layer Maurice McGlashan-Powell, Eugene J. O'Sullivan 2010-09-14
7790601 Forming interconnects with air gaps Samuel S. Choi, Lawrence A. Clevenger, Maxime Darnon, Satyanarayana V. Nitta, Shom Ponoth +1 more 2010-09-07
7741721 Electrical fuses and resistors having sublithographic dimensions Charles T. Black, Matthew E. Colburn, Timothy J. Dalton, Wai-Kin Li, Anthony K. Stamper +1 more 2010-06-22
7727890 High aspect ratio electroplated metal feature and method Keith Kwong Hon Wong, Chih-Chao Yang, Haining Yang 2010-06-01
7662722 Air gap under on-chip passive device Anthony K. Stamper, Anil K. Chinthakindi, Douglas D. Coolbaugh, Timothy J. Dalton, Ebenezer E. Eshun +3 more 2010-02-16
7638406 Method of fabricating a high Q factor integrated circuit inductor Panayotis Andricacos, John M. Cotte, Hariklia Deligianni, John Harold Magerlein, Kevin S. Petrarca +2 more 2009-12-29
RE40983 Method to plate C4 to copper stud Cyprian Emeka Uzoh 2009-11-17
7615482 Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strength Alexandros T. Demos, Stephen M. Gates, Alfred Grill, Steven E. Molis, Vu Ngoc Tran Nguyen +3 more 2009-11-10
7592685 Device and methodology for reducing effective dielectric constant in semiconductor devices Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons, Jeffrey P. Gambino +10 more 2009-09-22
7585722 Integrated circuit comb capacitor Anil K. Chinthakindi, Timothy J. Dalton, Ebenezer E. Eshun, Jeffrey P. Gambino, Sarah L. Lane +1 more 2009-09-08
7572682 Semiconductor structure for fuse and anti-fuse applications Chih-Chao Yang, Jack A. Mandelman, Louis L. Hsu 2009-08-11
7566653 Interconnect structure with grain growth promotion layer and method for forming the same Chih-Chao Yang 2009-07-28
7531444 Method to create air gaps using non-plasma processes to damage ILD materials Christos D. Dimitrakopoulos, Vincent J. McGahay, Satyanarayana V. Nittta, Kevin S. Petrarca, Shom Ponoth +1 more 2009-05-12
7528048 Planar vertical resistor and bond pad resistor and related method Douglas D. Coolbaugh, Timothy J. Dalton, Ebenezer E. Eshun, Jeffrey P. Gambino, Kevin S. Petrarca +2 more 2009-05-05
7517736 Structure and method of chemically formed anchored metallic vias Sanjay C. Mehta, John A. Fitzsimmons, Stephan Grunow, Henry A. Nye, III, David L. Rath 2009-04-14
7495338 Metal capped copper interconnect Michael Lane, Stefanie Chiras, Terry A. Spooner, Robert Rosenberg 2009-02-24
7494912 Terminal pad structures and methods of fabricating same Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Robert M. Rassel, Anthony K. Stamper 2009-02-24
7479306 SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same Stephen M. Gates, Alfred Grill, Michael Lane, Qinghuang Lin, Robert D. Miller +2 more 2009-01-20