Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8492268 | IC having viabar interconnection and related method | Dureseti Chidambarrao, Stephen E. Greco | 2013-07-23 |
| 8299622 | IC having viabar interconnection and related method | Dureseti Chidambarrao, Stephen E. Greco | 2012-10-30 |
| 7125790 | Inclusion of low-k dielectric material between bit lines | Larry A. Nesbit, George C. Feng | 2006-10-24 |
| 7097777 | Magnetic switching device | Gregory Costrini, John P. Hummel, George Stojakovic | 2006-08-29 |
| 7087438 | Encapsulation of conductive lines of semiconductor devices | Ihar Kasko, John P. Hummel | 2006-08-08 |
| 6985384 | Spacer integration scheme in MRAM technology | Gregory Costrini, John P. Hummel, Igor Kasko, Frank Findeis, Wolfgang Raberg | 2006-01-10 |
| 6974770 | Self-aligned mask to reduce cell layout area | Gregory Costrini, David L. Rath, Michael C. Gaidis, Walter Glashauser | 2005-12-13 |
| 6884630 | Two-step magnetic tunnel junction stack deposition | Arunava Gupta | 2005-04-26 |
| 6858441 | MRAM MTJ stack to conductive line alignment method | Joachim Nuetzel, Xian Jay Ning, Gill Yong Lee, Rajiv Ranade, Ravikumar Ramachandran | 2005-02-22 |
| 6846683 | Method of forming surface-smoothing layer for semiconductor devices with magnetic material layers | — | 2005-01-25 |
| 6768150 | Magnetic memory | Joerg Schmid | 2004-07-27 |
| 6743642 | Bilayer CMP process to improve surface roughness of magnetic stack in MRAM technology | Gregory Costrini, John P. Hummel, Mahadevaiyer Krishnan | 2004-06-01 |
| 6740539 | Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates | Richard A. Conti, Prakash Dev, David M. Dobuzinsky, Daniel C. Edelstein, Gill Yong Lee +3 more | 2004-05-25 |
| 6680500 | Insulating cap layer and conductive cap layer for semiconductor devices with magnetic material layers | John P. Hummel, Igor Kasko, Gregory Costrini | 2004-01-20 |
| 6570256 | Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates | Richard A. Conti, Prakash Dev, David M. Dobuzinsky, Daniel C. Edelstein, Gill Yong Lee +3 more | 2003-05-27 |