KL

Kia-Seng Low

IBM: 11 patents #9,995 of 70,183Top 15%
Infineon Technologies Ag: 10 patents #886 of 7,486Top 15%
IN Infineon: 1 patents #4 of 37Top 15%
Overall (All Time): #324,829 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8492268 IC having viabar interconnection and related method Dureseti Chidambarrao, Stephen E. Greco 2013-07-23
8299622 IC having viabar interconnection and related method Dureseti Chidambarrao, Stephen E. Greco 2012-10-30
7125790 Inclusion of low-k dielectric material between bit lines Larry A. Nesbit, George C. Feng 2006-10-24
7097777 Magnetic switching device Gregory Costrini, John P. Hummel, George Stojakovic 2006-08-29
7087438 Encapsulation of conductive lines of semiconductor devices Ihar Kasko, John P. Hummel 2006-08-08
6985384 Spacer integration scheme in MRAM technology Gregory Costrini, John P. Hummel, Igor Kasko, Frank Findeis, Wolfgang Raberg 2006-01-10
6974770 Self-aligned mask to reduce cell layout area Gregory Costrini, David L. Rath, Michael C. Gaidis, Walter Glashauser 2005-12-13
6884630 Two-step magnetic tunnel junction stack deposition Arunava Gupta 2005-04-26
6858441 MRAM MTJ stack to conductive line alignment method Joachim Nuetzel, Xian Jay Ning, Gill Yong Lee, Rajiv Ranade, Ravikumar Ramachandran 2005-02-22
6846683 Method of forming surface-smoothing layer for semiconductor devices with magnetic material layers 2005-01-25
6768150 Magnetic memory Joerg Schmid 2004-07-27
6743642 Bilayer CMP process to improve surface roughness of magnetic stack in MRAM technology Gregory Costrini, John P. Hummel, Mahadevaiyer Krishnan 2004-06-01
6740539 Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates Richard A. Conti, Prakash Dev, David M. Dobuzinsky, Daniel C. Edelstein, Gill Yong Lee +3 more 2004-05-25
6680500 Insulating cap layer and conductive cap layer for semiconductor devices with magnetic material layers John P. Hummel, Igor Kasko, Gregory Costrini 2004-01-20
6570256 Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates Richard A. Conti, Prakash Dev, David M. Dobuzinsky, Daniel C. Edelstein, Gill Yong Lee +3 more 2003-05-27