Issued Patents All Time
Showing 126–150 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9245794 | Formation of alloy liner by reaction of diffusion barrier and seed layer for interconnect application | Chih-Chao Yang, Takeshi Nogami | 2016-01-26 |
| 9224686 | Single damascene interconnect structure | Shyng-Tsong Chen, Takeshi Nogami | 2015-12-29 |
| 9202863 | Structure with self aligned resist layer on an interconnect surface and method of making same | Elbert E. Huang, Robert D. Miller | 2015-12-01 |
| 9190321 | Self-forming embedded diffusion barriers | Cyril Cabral, Jr., Juntao Li, Takeshi Nogami | 2015-11-17 |
| 9171742 | Alignment of integrated circuit chip stack | Evan G. Colgan, Steven A. Cordes, Vijayeshwar D. Khanna, Kenneth F. Latzko, Qinghuang Lin +4 more | 2015-10-27 |
| 9105693 | Microelectronic structure including air gap | David V. Horak, Elbert E. Huang, Satyanarayana V. Nitta, Takeshi Nogami, Shom Ponoth +1 more | 2015-08-11 |
| 9099468 | Electronic fuse vias in interconnect structures | Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig +1 more | 2015-08-04 |
| 9070686 | Wiring switch designs based on a field effect device for reconfigurable interconnect paths | Stephen M. Gates, Ramachandran Muralidhar, Thomas Theis | 2015-06-30 |
| 9064937 | Substrate bonding with diffusion barrier structures | Douglas C. La Tulipe, Jr., Wei Lin, Deepika Priyadarshini, Spyridon Skordas, Tuan A. Vo +1 more | 2015-06-23 |
| 9064874 | Interconnect with titanium—oxide diffusion barrier | Takeshi Nogami | 2015-06-23 |
| 9059679 | Tunable interconnect structures, and integrated circuit containing the same | Alberto Valdes-Garcia, Stephen M. Gates, Wayne H. Woods, Jr. | 2015-06-16 |
| 9059251 | Microelectronic structure including air gap | David V. Horak, Elbert E. Huang, Satyanarayana V. Nitta, Takeshi Nogami, Shom Ponoth +1 more | 2015-06-16 |
| 9059177 | Doping of copper wiring structures in back end of line processing | Thomas W. Dyer, Tze-man Ko, Andrew H. Simon, Wei-Tsu Tseng | 2015-06-16 |
| 9013857 | Altering capacitance of MIM capacitor having reactive layer therein | Anthony K. Stamper | 2015-04-21 |
| 8986921 | Lithographic material stack including a metal-compound hard mask | Bryan G. Morris, Tuan A. Vo, Christopher J. Waskiewicz, Yunpeng Yin | 2015-03-24 |
| 8969197 | Copper interconnect structure and its formation | Takeshi Nogami, Christopher C. Parks, Tsong-Lin Tai | 2015-03-03 |
| 8927421 | Interconnect structures and methods of manufacturing of interconnect structures | Takeshi Nogami | 2015-01-06 |
| 8916461 | Electronic fuse vias in interconnect structures | Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig +1 more | 2014-12-23 |
| 8860095 | Interconnect wiring switches and integrated circuits including the same | Stephen M. Gates, Kailash Gopalakrishnan, Ramachandran Muralidhar | 2014-10-14 |
| 8841770 | Semiconductor interconnect structure having enhanced performance and reliability | Cyril Cabral, Jr., Geraud Jean-Michel Dubois, Takeshi Nogami, Daniel P. Sanders | 2014-09-23 |
| 8772942 | Interconnect structure employing a Mn-group VIIIB alloy liner | Takeshi Nogami, Kazumichi Tsumura, Takamasa Usui | 2014-07-08 |
| 8765602 | Doping of copper wiring structures in back end of line processing | Thomas W. Dyer, Tze-man Ko, Andrew H. Simon, Wei-Tsu Tseng | 2014-07-01 |
| 8759976 | Structure with sub-lithographic random conductors as a physical unclonable function | Gregory M. Fritz, Stephen M. Gates, Dirk Pfeiffer | 2014-06-24 |
| 8742581 | Enhanced diffusion barrier for interconnect structures | Chih-Chao Yang, Steven E. Molis | 2014-06-03 |
| 8716134 | Interconnect structure employing a Mn-group VIIIB alloy liner | Takeshi Nogami, Kazumichi Tsumura, Takamasa Usui | 2014-05-06 |