Issued Patents All Time
Showing 76–100 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9941213 | Nitridized ruthenium layer for formation of cobalt interconnects | Chih-Chao Yang | 2018-04-10 |
| 9941212 | Nitridized ruthenium layer for formation of cobalt interconnects | Chih-Chao Yang | 2018-04-10 |
| 9911690 | Interconnect structures with fully aligned vias | Nicholas C. M. Fuller, Elbert E. Huang, Satyanarayana V. Nitta, David L. Rath | 2018-03-06 |
| 9905667 | Lateral bipolar transistor | Fabio Carta, Stephen M. Gates, Bahman Hekmatshoartabari, Tak H. Ning | 2018-02-27 |
| 9893012 | Advanced e-fuse structure with hybrid metal controlled microstructure | Chih-Chao Yang | 2018-02-13 |
| 9870993 | Simultaneous formation of liner and metal conductor | Chih-Chao Yang | 2018-01-16 |
| 9859433 | Cobalt top layer advanced metallization for interconnects | Chih-Chao Yang | 2018-01-02 |
| 9859215 | Formation of advanced interconnects | Chih-Chao Yang | 2018-01-02 |
| 9859209 | Advanced e-Fuse structure with enhanced electromigration fuse element | Chih-Chao Yang | 2018-01-02 |
| 9859155 | Cobalt first layer advanced metallization for interconnects | Chih-Chao Yang | 2018-01-02 |
| 9852990 | Cobalt first layer advanced metallization for interconnects | Chih-Chao Yang | 2017-12-26 |
| 9831181 | Simultaneous formation of liner and metal conductor | Chih-Chao Yang | 2017-11-28 |
| 9824917 | Method and apparatus for single chamber treatment | Chih-Chao Yang | 2017-11-21 |
| 9812391 | Advanced metallization for damage repair | Chih-Chao Yang | 2017-11-07 |
| 9806024 | Simultaneous formation of liner and metal conductor | Chih-Chao Yang | 2017-10-31 |
| 9799605 | Advanced copper interconnects with hybrid microstructure | Chih-Chao Yang | 2017-10-24 |
| 9786605 | Advanced through substrate via metallization in three dimensional semiconductor integration | Chih-Chao Yang | 2017-10-10 |
| 9773737 | Advanced metallization for damage repair | Chih-Chao Yang | 2017-09-26 |
| 9761529 | Advanced metallization for damage repair | Chih-Chao Yang | 2017-09-12 |
| 9728399 | Simultaneous formation of liner and metal conductor | Chih-Chao Yang | 2017-08-08 |
| 9721835 | Modulating microstructure in interconnects | Chih-Chao Yang | 2017-08-01 |
| 9721788 | Simultaneous formation of liner and metal conductor | Chih-Chao Yang | 2017-08-01 |
| 9716088 | 3D bonded semiconductor structure with an embedded capacitor | Chih-Chao Yang | 2017-07-25 |
| 9716063 | Cobalt top layer advanced metallization for interconnects | Chih-Chao Yang | 2017-07-25 |
| 9702042 | Method and apparatus for single chamber treatment | Chih-Chao Yang | 2017-07-11 |