Issued Patents All Time
Showing 26–50 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10643890 | Ultrathin multilayer metal alloy liner for nano Cu interconnects | Alfred Grill, Seth L. Knupp, Son V. Nguyen, Takeshi Nogami, Vamsi K. Paruchuri +2 more | 2020-05-05 |
| 10615074 | Advanced copper interconnects with hybrid microstructure | Chih-Chao Yang | 2020-04-07 |
| 10607933 | Interconnect structures with fully aligned vias | Nicholas C. M. Fuller, Elbert E. Huang, Satyanarayana V. Nitta, David L. Rath | 2020-03-31 |
| 10593591 | Interconnect structure | Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha | 2020-03-17 |
| 10586921 | Forming self-aligned contacts on pillar structures | Anthony J. Annunziata, Eugene J. O'Sullivan, Henry K. Utomo | 2020-03-10 |
| 10586920 | Forming self-aligned contacts on pillar structures | Anthony J. Annunziata, Eugene J. O'Sullivan, Henry K. Utomo | 2020-03-10 |
| 10559751 | Bottom electrode for semiconductor memory device | Chih-Chao Yang, Theodorus E. Standaert | 2020-02-11 |
| 10396013 | Advanced through substrate via metallization in three dimensional semiconductor integration | Chih-Chao Yang | 2019-08-27 |
| 10396012 | Advanced through substrate via metallization in three dimensional semiconductor integration | Chih-Chao Yang | 2019-08-27 |
| 10325806 | Copper interconnect structure with manganese oxide barrier layer | Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha | 2019-06-18 |
| 10325978 | Resistors with controlled resistivity | Chih-Chao Yang | 2019-06-18 |
| 10312181 | Advanced through substrate via metallization in three dimensional semiconductor integration | Chih-Chao Yang | 2019-06-04 |
| 10297569 | Method of forming a three-dimensional bonded semiconductor structure having nitridized oxide regions | Chih-Chao Yang | 2019-05-21 |
| 10283583 | 3D resistor structure with controlled resistivity | Chih-Chao Yang | 2019-05-07 |
| 10276649 | Metal resistors having nitridized dielectric surface layers and nitridized metal surface layers | Chih-Chao Yang | 2019-04-30 |
| 10276501 | Formation of liner and metal conductor | Chih-Chao Yang | 2019-04-30 |
| 10276435 | Advanced copper interconnects with hybrid microstructure | Chih-Chao Yang | 2019-04-30 |
| 10249703 | Metal resistors having nitridized metal surface layers with different nitrogen content | Chih-Chao Yang | 2019-04-02 |
| 10249702 | Metal resistors having varying resistivity | Chih-Chao Yang | 2019-04-02 |
| 10236257 | Cobalt top layer advanced metallization for interconnects | Chih-Chao Yang | 2019-03-19 |
| 10224241 | Copper interconnect structure with manganese oxide barrier layer | Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha | 2019-03-05 |
| 10217809 | Method of forming resistors with controlled resistivity | Chih-Chao Yang | 2019-02-26 |
| 10211280 | Method of forming tunable resistor with curved resistor elements | Chih-Chao Yang | 2019-02-19 |
| 10211279 | Tunable resistor with curved resistor elements | Chih-Chao Yang | 2019-02-19 |
| 10211148 | Structural enhancement of Cu nanowires | Chih-Chao Yang | 2019-02-19 |