Patent Leaderboard
USPTO Patent Rankings Data through Sept 30, 2025
TD

Timothy J. Dalton

IBM: 171 patents #222 of 70,183Top 1%
Infineon Technologies Ag: 9 patents #1,105 of 7,486Top 15%
Globalfoundries: 2 patents #1,397 of 4,424Top 35%
DEDigital Equipment: 1 patents #1,005 of 2,100Top 50%
MIT: 1 patents #4,386 of 9,367Top 50%
Ridgefield, CT: #3 of 574 inventorsTop 1%
Connecticut: #29 of 34,797 inventorsTop 1%
Overall (All Time): #4,520 of 4,157,543Top 1%
175 Patents All Time

Issued Patents All Time

Showing 51–75 of 175 patents

Patent #TitleCo-InventorsDate
7868374 Semitubular metal-oxide-semiconductor field effect transistor Kangguo Cheng, Lawrence A. Clevenger, Louis L. Hsu, Jack A. Mandelman 2011-01-11
7863734 Dual-sided chip attached modules Kerry Bernstein, Timothy H. Daubenspeck, Jeffrey P. Gambino, Mark D. Jaffe, Christopher D. Muzzy +3 more 2011-01-04
7865694 Three-dimensional networking structure Kerry Bernstein, Marc R. Faucher, Peter A. Sandon 2011-01-04
7851321 Semiconductor integrated circuit devices having high-Q wafer back-side capacitors Lawrence A. Clevenger, Louis L. Hsu, Carl Radens, Vidhya Ramachandran, Keith Kwong Hon Wong +1 more 2010-12-14
7838873 Structure for stochastic integrated circuit personalization Lawrence A. Clevenger, Matthew E. Colburn, Michael C. Gaidis, Louis L. Hsu, Carl Radens +2 more 2010-11-23
7825420 Method for forming slot via bitline for MRAM devices Michael C. Gaidis, Carl Radens, Lawrence A. Clevenger, Louis L. Hsu, Keith Kwong Hon Wong +1 more 2010-11-02
7821051 MIM capacitor and method of fabricating same Chih-Chao Yang, Lawrence A. Clevenger, Louis C. Hsu 2010-10-26
7820559 Structure to improve adhesion between top CVD low-K dielectric and dielectric capping layer Lawrence A. Clevenger, Stefanie Chiras, James J. Demarest, Darren N. Dunn, Chester T. Dziobkowski +7 more 2010-10-26
7811926 Multilayer hardmask scheme for damage-free dual damascene processing of SiCOH dielectrics Nicholas C. M. Fuller, Stephen M. Gates 2010-10-12
7767587 Method of forming an interconnection structure in a organosilicate glass having a porous layer with higher carbon content located between two lower carbon content non-porous layers Nicholas C. M. Fuller 2010-08-03
7749778 Addressable hierarchical metal wire test methodology Kaushik Chanda, Lawrence A. Clevenger, Louis L. Hsu, Chih-Chao Yang 2010-07-06
7741721 Electrical fuses and resistors having sublithographic dimensions Charles T. Black, Matthew E. Colburn, Daniel C. Edelstein, Wai-Kin Li, Anthony K. Stamper +1 more 2010-06-22
7726010 Method of forming a micro-electromechanical (MEMS) switch Louis C. Hsu, Lawrence A. Clevenger, Carl Radens, Keith Kwong Hon Wong, Chih-Chao Yang 2010-06-01
7700410 Chip-in-slot interconnect for 3D chip stacks Kerry Bernstein, Edmund J. Sprogis, Anthony K. Stamper, Richard Q. Williams 2010-04-20
7670927 Double-sided integrated circuit chips Kerry Bernstein, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke, Stephen E. Luce +1 more 2010-03-02
7670921 Structure and method for self aligned vertical plate capacitor Anil K. Chinthakindi, Douglas D. Coolbaugh, Ebenezer E. Eshun, Jeffrey P. Gambino, Anthony K. Stamper +1 more 2010-03-02
7662722 Air gap under on-chip passive device Anthony K. Stamper, Anil K. Chinthakindi, Douglas D. Coolbaugh, Daniel C. Edelstein, Ebenezer E. Eshun +3 more 2010-02-16
7657995 Method of fabricating a microelectromechanical system (MEMS) switch Louis C. Hsu, Lawrence A. Clevenger, Carl Radens, Kwong Hon Wong, Chih-Chao Yang 2010-02-09
7635884 Method and structure for forming slot via bitline for MRAM devices Michael C. Gaidis, Carl Radens, Lawrence A. Clevenger, Louis L. Hsu, Keith Kwong Hon Wong +1 more 2009-12-22
7598616 Interconnect structure Chih-Chao Yang, Lawrence A. Clevenger, Andrew P. Cowley, Meeyoung H. Yoon 2009-10-06
7592685 Device and methodology for reducing effective dielectric constant in semiconductor devices Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, John A. Fitzsimmons, Jeffrey P. Gambino +10 more 2009-09-22
7585722 Integrated circuit comb capacitor Daniel C. Edelstein, Anil K. Chinthakindi, Ebenezer E. Eshun, Jeffrey P. Gambino, Sarah L. Lane +1 more 2009-09-08
7563710 Method of fabrication of interconnect structures Chih-Chao Yang, Lawrence A. Clevenger, Andrew P. Cowley, Meeyoung H. Yoon 2009-07-21
7546670 Method for producing thermally matched probe assembly Samuel McKnight, George F. Walker, Simon Karecki 2009-06-16
7544578 Structure and method for stochastic integrated circuit personalization Lawrence A. Clevenger, Matthew E. Colburn, Michael C. Gaidis, Louis L. Hsu, Carl Radens +2 more 2009-06-09