Issued Patents All Time
Showing 76–100 of 175 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7531407 | Semiconductor integrated circuit devices having high-Q wafer backside inductors and methods of fabricating same | Lawrence A. Clevenger, Louis L. Hsu, Carl Radens, Vidhya Ramachandran, Keith Kwong Hon Wong +1 more | 2009-05-12 |
| 7528065 | Structure and method for MOSFET gate electrode landing pad | Lawrence A. Clevenger, Louis C. Hsu, Carl Radens, Kwong Hon Wong, Chih-Chao Yang | 2009-05-05 |
| 7528048 | Planar vertical resistor and bond pad resistor and related method | Douglas D. Coolbaugh, Daniel C. Edelstein, Ebenezer E. Eshun, Jeffrey P. Gambino, Kevin S. Petrarca +2 more | 2009-05-05 |
| 7528493 | Interconnect structure and method of fabrication of same | Chih-Chao Yang, Lawrence A. Clevenger, Andrew P. Cowley, Meeyoung H. Yoon | 2009-05-05 |
| 7526698 | Error detection and correction in semiconductor structures | Marc R. Faucher, Paul D. Kartschoke, Peter A. Sandon | 2009-04-28 |
| 7514271 | Method of forming high density planar magnetic domain wall memory | Michael C. Gaidis, Lawrence A. Clevenger, John K. DeBrosse, Louis L. Hsu, Carl Radens +2 more | 2009-04-07 |
| 7504727 | Semiconductor interconnect structure utilizing a porous dielectric material as an etch stop layer between adjacent non-porous dielectric materials | Nicholas C. M. Fuller | 2009-03-17 |
| 7497959 | Methods and structures for protecting one area while processing another area on a chip | Deok-kee Kim, Kenneth T. Settlemyer, Jr., Kangguo Cheng, Ramachandra Divakaruni, Carl Radens +4 more | 2009-03-03 |
| 7494915 | Back end interconnect with a shaped interface | Lawrence A. Clevenger, Andrew P. Cowley, Mark Hoinkis, Steffen K. Kaldor, Erdem Kaltalioglu +8 more | 2009-02-24 |
| 7488677 | Interconnect structures with encasing cap and methods of making thereof | Kwong Hon Wong, Louis C. Hsu, Carol Radens, Chih-Chao Yang, Lawrence A. Clevenger +1 more | 2009-02-10 |
| 7486845 | Waveguide polarization beam splitters and method of fabricating a waveguide wire-grid polarization beam splitter | Charles T. Black, Gian-Luca Bona, Nicholas C. M. Fuller, Roland Germann, Maurice McGlashan-Powell +2 more | 2009-02-03 |
| 7473979 | Semiconductor integrated circuit devices having high-Q wafer back-side capacitors | Lawrence A. Clevenger, Louis L. Hsu, Carl Radens, Vidhya Ramachandran, Keith Kwong Hon Wong +1 more | 2009-01-06 |
| 7462509 | Dual-sided chip attached modules | Kerry Bernstein, Timothy H. Daubenspeck, Jeffrey P. Gambino, Mark D. Jaffe, Christopher D. Muzzy +3 more | 2008-12-09 |
| 7439151 | Method and structure for integrating MIM capacitors within dual damascene processing techniques | Douglas D. Coolbaugh, Ebenezer E. Eshun, Vincent J. McGahay, Anthony K. Stamper, Kunal Vaed | 2008-10-21 |
| 7439174 | Multilayer hardmask scheme for damage-free dual damascene processing of SiCOH dielectrics | Nicholas C. M. Fuller, Stephen M. Gates | 2008-10-21 |
| 7435676 | Dual damascene process flow enabling minimal ULK film modification and enhanced stack integrity | Nicholas C. M. Fuller, Satyanarayana V. Nitta | 2008-10-14 |
| 7435671 | Trilayer resist scheme for gate etching applications | Nicholas C. M. Fuller, Ying Zhang | 2008-10-14 |
| 7427550 | Methods of fabricating passive element without planarizing | Anil K. Chinthakindi, Ebenezer E. Eshun, Jeffrey P. Gambino, Anthony K. Stamper, Kunal Vaed | 2008-09-23 |
| 7405147 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, John A. Fitzsimmons, Jeffrey P. Gambino +10 more | 2008-07-29 |
| 7402532 | Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer | Lawrence A. Clevenger, Stefanie Chiras, James J. Demarest, Derren N. Dunn, Chester T. Dziobkowski +7 more | 2008-07-22 |
| 7402463 | Adopting feature of buried electrically conductive layer in dielectrics for electrical anti-fuse application | Chih-Chao Yang, Lawrence A. Clevenger, Nicholas C. M. Fuller, Louis C. Hsu | 2008-07-22 |
| 7394110 | Planar vertical resistor and bond pad resistor | Douglas D. Coolbaugh, Daniel C. Edelstein, Ebenezer E. Eshun, Jeffrey P. Gambino, Kevin S. Petrarca +2 more | 2008-07-01 |
| 7393776 | Method of forming closed air gap interconnects and structures formed thereby | Matthew E. Colburn, Elbert E. Huang, Satya V. Nitta, Sampath Purushothaman, Katherine L. Saenger +2 more | 2008-07-01 |
| 7394145 | Methods of fabricating passive element without planarizing and related semiconductor device | Anil K. Chinthakindi, Ebenezer E. Eshun, Jeffrey P. Gambino, Anthony K. Stamper, Kunal Vaed | 2008-07-01 |
| 7394332 | Micro-cavity MEMS device and method of fabricating same | Louis C. Hsu, Lowrence A. Clevenger, Carl Radens, Keith Kwong Hon Wong, Chih-Chao Yang | 2008-07-01 |