Issued Patents All Time
Showing 126–150 of 175 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7122462 | Back end interconnect with a shaped interface | Lawrence A. Clevenger, Andrew P. Cowley, Mark Hoinkis, Steffen K. Kaldor, Erdem Kaltalioglu +8 more | 2006-10-17 |
| 7115921 | Nano-scaled gate structure with self-interconnect capabilities | Lawrence A. Clevenger, Louis L. Hsu, Carl Radens, Keith Kwong Hon Wong, Chih-Chao Yang | 2006-10-03 |
| 7105445 | Interconnect structures with encasing cap and methods of making thereof | Kwong Hon Wong, Louis C. Hsu, Carl Radens, Chih-Chao Yang, Lawrence A. Clevenger +1 more | 2006-09-12 |
| 7102232 | Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer | Lawrence A. Clevenger, Stefanie Chiras, James J. Demarest, Derren N. Dunn, Chester T. Dziobkowski +7 more | 2006-09-05 |
| 7098476 | Multilayer interconnect structure containing air gaps and method for making | Katherina Babich, Roy A. Carruthers, Alfred Grill, Jeffrey Hedrick, Christopher V. Jahnes +4 more | 2006-08-29 |
| 7092235 | Method for adjusting capacitance of an on-chip capacitor | Lawrence A. Clevenger, Louis L. Hsu, Carl Radens, Keith Kwong Hon Wong, Chih-Chao Yang | 2006-08-15 |
| 7091542 | Method of forming a MIM capacitor for Cu BEOL application | Chih-Chao Yang, Lawrence A. Clevenger, Gerald Matusiewicz | 2006-08-15 |
| 7091612 | Dual damascene structure and method | Kaushik A. Kumar, Larry Clevenger, Andy Cowley, Douglas C. La Tulipe, Jr., Mark Hoinkis +5 more | 2006-08-15 |
| 7084479 | Line level air gaps | Shyng-Tsong Chen, Stefanie Chiras, Matthew E. Colburn, Jeffrey Hedrick, Elbert E. Huang +9 more | 2006-08-01 |
| 7064064 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin, Steffen K. Kaldor +11 more | 2006-06-20 |
| 7060624 | Deep filled vias | Panayotis Andricacos, Emanuel I. Cooper, Hariklia Deligianni, Daniel Guidotti, Keith Kwietniak +2 more | 2006-06-13 |
| 7052621 | Bilayered metal hardmasks for use in Dual Damascene etch schemes | Kaushik A. Kumar, Lawrence A. Clevenger, Douglas C. La Tulipe, Jr., Andy Cowley, Erdem Kaltalioglu +5 more | 2006-05-30 |
| 7049209 | De-fluorination of wafer surface and related structure | Nicholas Fuller, Kaushik A. Kumar, Catherine B. Labelle | 2006-05-23 |
| 7045453 | Very low effective dielectric constant interconnect structures and methods for fabricating the same | Donald F. Canaperi, Stephen M. Gates, Mahadevaiyer Krishnan, Satya V. Nitta, Sampath Purushothaman +1 more | 2006-05-16 |
| 7023093 | Very low effective dielectric constant interconnect Structures and methods for fabricating the same | Donald F. Canaperi, Stephen M. Gates, Mahadevaiyer Krishnan, Satya V. Nitta, Sampath Purushothaman +1 more | 2006-04-04 |
| 7014958 | Method for dry etching photomask material | Thomas B. Faure, Michelle L. Steen | 2006-03-21 |
| 7014959 | CD uniformity of chrome etch to photomask process | Shaun Crawford, Thomas B. Faure, Cuc K. Huynh, Michelle L. Steen, Thomas M. Wagner | 2006-03-21 |
| 7001835 | Crystallographic modification of hard mask properties | Lawrence A. Clevenger, Andrew P. Cowley, Mark Hoinkis, Steffen K. Kaldor, Kaushik A. Kumar +3 more | 2006-02-21 |
| 6975032 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin, Steffen K. Kaldor +11 more | 2005-12-13 |
| 6960519 | Interconnect structure improvements | John A. Fitzsimmons, Jeffrey P. Gambino, Lee M. Nicholson, Andrew H. Simon, Anthony K. Stamper | 2005-11-01 |
| 6933191 | Two-mask process for metal-insulator-metal capacitors and single mask process for thin film resistors | Glenn A. Biery, Zheng Chen, Naftali E. Lustig | 2005-08-23 |
| 6927472 | Fuse structure and method to form the same | David K. Anderson, Tien-Jen Cheng, Christopher V. Jahnes, Andrew Lu, Chandrasekhar Narayan +3 more | 2005-08-09 |
| 6924185 | Fuse structure and method to form the same | David K. Anderson, Tien-Jen Cheng, Christopher V. Jahnes, Andrew Lu, Chandrasekhar Narayan +3 more | 2005-08-02 |
| 6873027 | Encapsulated energy-dissipative fuse for integrated circuits and method of making the same | Kevin S. Petrarca, Richard P. Volant | 2005-03-29 |
| 6869895 | Method for adjusting capacitance of an on-chip capacitor | Lawrence A. Clevenger, Louis L. Hsu, Carl Radens, Keith Kwong Hon Wong, Chih-Chao Yang | 2005-03-22 |