Patent Leaderboard
USPTO Patent Rankings Data through Sept 30, 2025
TD

Timothy J. Dalton

IBM: 171 patents #222 of 70,183Top 1%
Infineon Technologies Ag: 9 patents #1,105 of 7,486Top 15%
Globalfoundries: 2 patents #1,397 of 4,424Top 35%
DEDigital Equipment: 1 patents #1,005 of 2,100Top 50%
MIT: 1 patents #4,386 of 9,367Top 50%
Ridgefield, CT: #3 of 574 inventorsTop 1%
Connecticut: #29 of 34,797 inventorsTop 1%
Overall (All Time): #4,520 of 4,157,543Top 1%
175 Patents All Time

Issued Patents All Time

Showing 101–125 of 175 patents

Patent #TitleCo-InventorsDate
7381627 Dual wired integrated circuit chips Kerry Bernstein, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke, Anthony K. Stamper 2008-06-03
7378350 Formation of low resistance via contacts in interconnect structures Stephen M. Gates 2008-05-27
7371461 Multilayer hardmask scheme for damage-free dual damascene processing of SiCOH dielectrics Nicholas C. M. Fuller, Stephen M. Gates 2008-05-13
7365001 Interconnect structures and methods of making thereof Chih-Chao Yang, Louis L. Hsu, Keith Kwong Hon Wong, Carl Radens, Larry Clevenger 2008-04-29
7365412 Vertical parallel plate capacitor using spacer shaped electrodes and method for fabrication thereof Jeffrey P. Gambino, Anthony K. Stamper 2008-04-29
7361991 Closed air gap interconnect structure Simon Karecki, Maheswaran Surendra, Satya V. Nitta, Sampath Purushothaman, Matthew E. Colburn +2 more 2008-04-22
7358182 Method of forming an interconnect structure Heidi Baks, Shyng-Tsong Chen, Nicholas Fuller, Kaushik A. Kumar 2008-04-15
7352064 Multiple layer resist scheme implementing etch recipe particular to each layer Nicholas C. M. Fuller, Raymond Joy, Yi-Hsiung Lin, Chun Hui Low 2008-04-01
7348870 Structure and method of fabricating a hinge type MEMS switch Louis C. Hsu, Lawrence A. Clevenger, Carl Radens, Kwong Hon Wong, Chih-Chao Yang 2008-03-25
7344965 Method of etching dual pre-doped polysilicon gate stacks using carbon-containing gaseous additions Ying Zhang, Wesley C. Natzle 2008-03-18
7335588 Interconnect structure and method of fabrication of same Chih-Chao Yang, Lawrence A. Clevenger, Andrew P. Cowley, Meeyoung H. Yoon 2008-02-26
7309649 Method of forming closed air gap interconnects and structures formed thereby Simon Karecki, Elbert E. Huang, Satya V. Nitta, Sampath Purushothaman, Katherine L. Saenger +2 more 2007-12-18
7298935 Waveguide polarization beam splitters and method of fabricating a waveguide wire-grid polarization beam splitter Charles T. Black, Gian-Luca Bona, Nicholas C. M. Fuller, Roland Germann, Maurice McGlashan-Powell +2 more 2007-11-20
7285477 Dual wired integrated circuit chips Kerry Bernstein, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke, Anthony K. Stamper 2007-10-23
7282802 Modified via bottom structure for reliability enhancement Lawrence A. Clevenger, Louis C. Hsu, Conal E. Murray, Carl Radens, Kwong Hon Wong +1 more 2007-10-16
7282148 Porous silicon composite structure as large filtration array Michelle L. Steen 2007-10-16
7282441 De-fluorination after via etch to preserve passivation Nicholas C. M. Fuller 2007-10-16
7253116 High ion energy and reative species partial pressure plasma ash process Nicholas C. M. Fuller 2007-08-07
7241681 Bilayered metal hardmasks for use in dual damascene etch schemes Kaushik A. Kumar, Lawrence A. Clevenger, Douglas C. La Tulipe, Jr., Andy Cowley, Erdem Kaltalioglu +5 more 2007-07-10
7241696 Method for depositing a metal layer on a semiconductor interconnect structure having a capping layer Larry Clevenger, Mark Hoinkis, Steffen K. Kaldor, Kaushik A. Kumar, Douglas C. La Tulipe, Jr. +5 more 2007-07-10
7223654 MIM capacitor and method of fabricating same Chih-Chao Yang, Lawrence A. Clevenger, Louis C. Hsu 2007-05-29
7223691 Method of forming low resistance and reliable via in inter-level dielectric interconnect Cyril Cabral, Jr., Lawrence A. Clevenger, Patrick W. DeHaven, Chester T. Dziobkowski, Sunfei Fang +4 more 2007-05-29
7196014 System and method for plasma induced modification and improvement of critical dimension uniformity Ronald Della Guardia, Nicholas C. M. Fuller 2007-03-27
7193423 Wafer-to-wafer alignments Jeffrey P. Gambino, Mark D. Jaffe, Stephen E. Luce, Edmund J. Sprogis 2007-03-20
7125792 Dual damascene structure and method Kaushik A. Kumar, Douglas C. La Tulipe, Jr., Larry Clevenger, Andy Cowley, Erdem Kaltalioglu +1 more 2006-10-24