Issued Patents All Time
Showing 51–60 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6436814 | Interconnection structure and method for fabricating same | David V. Horak, William A. Klaasen, Mark P. Murray, Anthony K. Stamper | 2002-08-20 |
| 6333559 | Method/structure for creating aluminum wirebound pad on copper BEOL | Gregory Costrini, Ronald D. Goldblatt, John E. Heidenreich, III | 2001-12-25 |
| 6310300 | Fluorine-free barrier layer between conductor and insulator for degradation prevention | Edward C. Cooney, III, Hyun Koo Lee, Anthony K. Stamper | 2001-10-30 |
| 6214730 | Fluorine barrier layer between conductor and insulator for degradation prevention | Edward C. Cooney, III, Hyun Koo Lee, Anthony K. Stamper | 2001-04-10 |
| 6187680 | Method/structure for creating aluminum wirebound pad on copper BEOL | Gregory Costrini, Ronald D. Goldblatt, John E. Heidenreich, III | 2001-02-13 |
| 6066577 | Method for providing fluorine barrier layer between conductor and insulator for degradation prevention | Edward C. Cooney, III, Hyun Koo Lee, Anthony K. Stamper | 2000-05-23 |
| 5930655 | Fluorine barrier layer between conductor and insulator for degradation prevention | Edward C. Cooney, III, Hyun Koo Lee, Anthony K. Stamper | 1999-07-27 |
| 5494860 | Two step annealing process for decreasing contact resistance | Scott L. Pennington, Michael A. Smey | 1996-02-27 |
| 5486267 | Method for applying photoresist | Stephen E. Knight, Stephen E. Luce | 1996-01-23 |
| 5401675 | Method of depositing conductors in high aspect ratio apertures using a collimator | Pei-Ing Lee, Thomas J. Licata, Paul C. Parries, Scott L. Pennington, James G. Ryan +1 more | 1995-03-28 |