| 9708508 |
Slurry for chemical-mechanical polishing of metals and use thereof |
Graham M. Bates, Michael T. Brigham, Joseph K. V. Comeau, Jason P. Ritter, Matthew T. Tiersch +1 more |
2017-07-18 |
| 9057004 |
Slurry for chemical-mechanical polishing of metals and use thereof |
Graham M. Bates, Michael T. Brigham, Joseph K. V. Comeau, Jason P. Ritter, Matthew T. Tiersch +1 more |
2015-06-16 |
| 8877596 |
Semiconductor devices with asymmetric halo implantation and method of manufacture |
Darshana N. Bhagat, Thomas J. Dunbar, Yen L. Lim, Jed H. Rankin |
2014-11-04 |
| 8734665 |
Slurry for chemical-mechanical polishing of copper and use thereof |
Graham M. Bates, Michael T. Brigham, Joseph K. V. Comeau, Jason P. Ritter, Matthew T. Tiersch +1 more |
2014-05-27 |
| 8637403 |
Locally tailoring chemical mechanical polishing (CMP) polish rate for dielectrics |
Yoba Amoah, Graham M. Bates, Joseph P. Hasselbach, Thomas L. McDevitt |
2014-01-28 |
| 8575022 |
Top corner rounding of damascene wire for insulator crack suppression |
Gregory S. Chrisman, Edward C. Cooney, III, Jeffrey P. Gambino, Zhong-Xiang He, Thomas L. McDevitt |
2013-11-05 |
| 8088690 |
CMP method |
Thomas L. McDevitt, Graham M. Bates, Matthew T. Tiersch, Eric J. White |
2012-01-03 |
