Issued Patents All Time
Showing 26–50 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8343868 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Timothy J. Dalton, John A. Fitzsimmons, Jeffrey P. Gambino +10 more | 2013-01-01 |
| 8294270 | Copper alloy via bottom liner | Daniel C. Edelstein, John A. Fitzsimmons, Jeffrey P. Gambino, Anthony K. Stamper | 2012-10-23 |
| 8242591 | Electrostatic chucking of an insulator handle substrate | Paul S. Andry, Edmund J. Sprogis, Anthony K. Stamper, Cornelia K. Tsang | 2012-08-14 |
| 8129286 | Reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Timothy J. Dalton, John A. Fitzsimmons, Jeffrey P. Gambino +10 more | 2012-03-06 |
| 8052799 | By-product collecting processes for cleaning processes | William J. Murphy, Anthony K. Stamper, David C. Strippe | 2011-11-08 |
| 7972965 | Process for interfacial adhesion in laminate structures through patterned roughing of a surface | Vincent J. McGahay, Thomas M. Shaw, Anthony K. Stamper, Matthew E. Colburn | 2011-07-05 |
| 7892940 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Timothy J. Dalton, John A. Fitzsimmons, Jeffrey P. Gambino +10 more | 2011-02-22 |
| 7879716 | Metal seed layer deposition | Steven P. Barkyoumb, Jonathan D. Chapple-Sokol, Keith E. Downes, Thomas L. McDevitt, William J. Murphy | 2011-02-01 |
| 7863180 | Through substrate via including variable sidewall profile | Peter J. Lindgren, Dorreen Jane Ossenkop, Anthony K. Stamper | 2011-01-04 |
| 7843039 | Stress-modified device structures, methods of fabricating such stress-modified device structures, and design structures for an integrated circuit | Mark D. Dupuis, William J. Murphy, Steven S. Williams | 2010-11-30 |
| 7741226 | Optimal tungsten through wafer via and process of fabricating same | Paul S. Andry, Peter J. Lindgren, Dorreen Jane Ossenkop, Cornelia K. Tsang | 2010-06-22 |
| 7704876 | Dual damascene interconnect structures having different materials for line and via conductors | Jeffrey P. Gambino, Anthony K. Stamper, William T. Motsiff, Michael Lane, Andrew H. Simon | 2010-04-27 |
| 7655547 | Metal spacer in single and dual damascene processing | Robert M. Geffken, Anthony K. Stamper | 2010-02-02 |
| 7592685 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Timothy J. Dalton, John A. Fitzsimmons, Jeffrey P. Gambino +10 more | 2009-09-22 |
| 7541679 | Exposed pore sealing post patterning | John A. Fitzsimmons, Jeffrey P. Gambino, Stephen E. Luce, Thomas L. McDevitt, Lee M. Nicholson +1 more | 2009-06-02 |
| 7517802 | Method for reducing foreign material concentrations in etch chambers | Anthony K. Stamper | 2009-04-14 |
| 7405147 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Timothy J. Dalton, John A. Fitzsimmons, Jeffrey P. Gambino +10 more | 2008-07-29 |
| 7393777 | Sacrificial metal spacer damascene process | Robert M. Geffken, Anthony K. Stamper | 2008-07-01 |
| 7381637 | Metal spacer in single and dual damascence processing | Robert M. Geffken, Anthony K. Stamper | 2008-06-03 |
| 7327033 | Copper alloy via bottom liner | Daniel C. Edelstein, John A. Fitzsimmons, Jeffrey P. Gambino, Anthony K. Stamper | 2008-02-05 |
| 7303994 | Process for interfacial adhesion in laminate structures through patterned roughing of a surface | Vincent J. McGahay, Thomas M. Shaw, Anthony K. Stamper, Matthew E. Colburn | 2007-12-04 |
| 7300867 | Dual damascene interconnect structures having different materials for line and via conductors | Jeffrey P. Gambino, Anthony K. Stamper, William T. Motsiff, Michael Lane, Andrew H. Simon | 2007-11-27 |
| 7235487 | Metal seed layer deposition | Steven P. Barkyoumb, Jonathan D. Chapple-Sokol, Keith E. Downes, Thomas L. McDevitt, William J. Murphy | 2007-06-26 |
| 7192874 | Method for reducing foreign material concentrations in etch chambers | Anthony K. Stamper | 2007-03-20 |
| 7045472 | Method and apparatus for selectively altering dielectric properties of localized semiconductor device regions | William T. Motsiff | 2006-05-16 |