Issued Patents All Time
Showing 51–69 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7015150 | Exposed pore sealing post patterning | John A. Fitzsimmons, Jeffrey P. Gambino, Stephen E. Luce, Thomas L. McDevitt, Lee M. Nicholson +1 more | 2006-03-21 |
| 6982227 | Single and multilevel rework | Robert M. Geffken, Vincent J. McGahay, William T. Motsiff, Mark P. Murray, Amanda Piper +4 more | 2006-01-03 |
| 6958540 | Dual damascene interconnect structures having different materials for line and via conductors | Jeffrey P. Gambino, Anthony K. Stamper, William T. Motsiff, Michael Lane, Andrew H. Simon | 2005-10-25 |
| 6888251 | Metal spacer in single and dual damascene processing | Robert M. Geffken, Anthony K. Stamper | 2005-05-03 |
| 6846741 | Sacrificial metal spacer damascene process | Robert M. Geffken, Anthony K. Stamper | 2005-01-25 |
| 6838355 | Damascene interconnect structures including etchback for low-k dielectric materials | Anthony K. Stamper, Jeffrey P. Gambino, Timothy J. Dalton, John A. Fitzsimmons, Lee M. Nicholson | 2005-01-04 |
| 6759260 | Metal oxide temperature monitor | Arne Ballantine, Jeffrey D. Gilbert, Robert G. Miller, Amy L. Myrick, Ronald A. Warren | 2004-07-06 |
| 6674168 | Single and multilevel rework | Robert M. Geffken, Vincent J. McGahay, William T. Motsiff, Mark P. Murray, Amanda Piper +4 more | 2004-01-06 |
| 6580140 | Metal oxide temperature monitor | Arne Ballantine, Jeffrey D. Gilbert, Robert G. Miller, Amy L. Myrick, Ronald A. Warren | 2003-06-17 |
| 6534394 | Process to create robust contacts and interconnects | William J. Murphy | 2003-03-18 |
| 6429524 | Ultra-thin tantalum nitride copper interconnect barrier | Anthony K. Stamper | 2002-08-06 |
| 6339022 | Method of annealing copper metallurgy | Arne Ballantine, George A. Dunbar, III, Cheryl G. Faltermeier, Jeffrey D. Gilbert, Ronald D. Goldblatt +9 more | 2002-01-15 |
| 6339258 | Low resistivity tantalum | Cyprian Emeka Uzoh | 2002-01-15 |
| 6310300 | Fluorine-free barrier layer between conductor and insulator for degradation prevention | Hyun Koo Lee, Thomas L. McDevitt, Anthony K. Stamper | 2001-10-30 |
| 6214730 | Fluorine barrier layer between conductor and insulator for degradation prevention | Hyun Koo Lee, Thomas L. McDevitt, Anthony K. Stamper | 2001-04-10 |
| 6210541 | Process and apparatus for cold copper deposition to enhance copper plating fill | Josef W. Korejwa, David C. Strippe | 2001-04-03 |
| 6176931 | Wafer clamp ring for use in an ionized physical vapor deposition apparatus | Darryl D. Restaino, Stephen M. Rossnagel, Andrew H. Simon, Pavel Smetana | 2001-01-23 |
| 6066577 | Method for providing fluorine barrier layer between conductor and insulator for degradation prevention | Hyun Koo Lee, Thomas L. McDevitt, Anthony K. Stamper | 2000-05-23 |
| 5930655 | Fluorine barrier layer between conductor and insulator for degradation prevention | Hyun Koo Lee, Thomas L. McDevitt, Anthony K. Stamper | 1999-07-27 |