Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6988882 | Transfer molding of integrated circuit packages | Marie-France Boyaud, Catherine Dufort, Marie-Claude Paquet | 2006-01-24 |
| 6956296 | Transfer molding of integrated circuit packages | Marie-France Boyaud, Catherine Dufort, Marie-Claude Paquet | 2005-10-18 |
| 6822875 | Assembly of opto-electronic module with improved heat sink | Benson Chan, Paul F. Fortier, Ladd W. Freitag, Gary T. Galli, Francois Guindon +3 more | 2004-11-23 |
| 6656773 | Transfer molding of integrated circuit packages | Marie-France Boyaud, Catherine Dufort, Marie-Claude Paquet | 2003-12-02 |
| 6547452 | Alignment systems for subassemblies of overmolded optoelectronic modules | Benson Chan, Paul F. Fortier, Francois Guindon, Glen Walden Johnson, Martial Letourneau +1 more | 2003-04-15 |
| 6508595 | Assembly of opto-electronic module with improved heat sink | Benson Chan, Paul F. Fortier, Ladd W. Freitag, Gary T. Galli, Francois Guindon +3 more | 2003-01-21 |
| 6309575 | Transfer molding method for forming integrated circuit package | Lynda Boutin, Martial Letourneau | 2001-10-30 |
| 5997798 | Biasing mold for integrated circuit chip assembly encapsulation | Joseph Georges Alain Tremblay | 1999-12-07 |
| 5939778 | Integrated circuit chip package | Lynda Boutin, Martial Letourneau | 1999-08-17 |