Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6309575 | Transfer molding method for forming integrated circuit package | Martial Letourneau, Real Tetreault | 2001-10-30 |
| 5939778 | Integrated circuit chip package | Martial Letourneau, Real Tetreault | 1999-08-17 |