Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6822875 | Assembly of opto-electronic module with improved heat sink | Benson Chan, Paul F. Fortier, Ladd W. Freitag, Gary T. Galli, Francois Guindon +3 more | 2004-11-23 |
| 6547452 | Alignment systems for subassemblies of overmolded optoelectronic modules | Benson Chan, Paul F. Fortier, Francois Guindon, Glen Walden Johnson, John H. Sherman +1 more | 2003-04-15 |
| 6508595 | Assembly of opto-electronic module with improved heat sink | Benson Chan, Paul F. Fortier, Ladd W. Freitag, Gary T. Galli, Francois Guindon +3 more | 2003-01-21 |
| 6309575 | Transfer molding method for forming integrated circuit package | Lynda Boutin, Real Tetreault | 2001-10-30 |
| 5939778 | Integrated circuit chip package | Lynda Boutin, Real Tetreault | 1999-08-17 |