Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8129230 | Underfill method and chip package | Michael A. Gaynes, Rajneesh Kumar, Steve Ostrander | 2012-03-06 |
| 6762119 | Method of preventing solder wetting in an optical device using diffusion of Cr | Sudipta K. Ray, Mitchell S. Cohen, Lester W. Herron, Mario J. Interrante, Subhash L. Shinde | 2004-07-13 |
| 6528352 | Use of conductive adhesive to form temporary electrical connections for use in TCA (temporary chip attach) applications | Raymond A. Jackson, John U. Knickerbocker, Amy B. Ostrander | 2003-03-04 |
| 6518674 | Temporary attach article and method for temporary attach of devices to a substrate | Mario J. Interrante, Frank L. Pompeo, William E. Sablinski | 2003-02-11 |
| 6376054 | Surface metallization structure for multiple chip test and burn-in | Scott I. Langenthal, Richard F. Indyk, John U. Knickerbocker, Srinivasa S. N. Reddy, Richard A. Shelleman +2 more | 2002-04-23 |
| 6303400 | Temporary attach article and method for temporary attach of devices to a substrate | Mario J. Interrante, Frank L. Pompeo, William E. Sablinski | 2001-10-16 |
| 5795217 | Stressed burnisher | Mark J. LaPlante, David C. Long, Anton Nenadic, Alan Piciacchio | 1998-08-18 |
| 5643818 | Removal of residues from metallic insert used in manufacture of multi-layer ceramic substrate with cavity for microelectronic chip | Krishna G. Sachdev, Vincent P. Peterson | 1997-07-01 |
| 5489465 | Edge seal technology for low dielectric/porous substrate processing | Govindarajan Natarajan, Takeshi Takamori, Katharine G. Frase, Robert A. Rita | 1996-02-06 |
| 5480503 | Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof | Jon A. Casey, David B. Goland, Dinesh Gupta, Lester W. Herron, James N. Humenik +3 more | 1996-01-02 |